Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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Purpose For Develop<strong>in</strong>gWafer Level <strong>Burn</strong>-In• WLBI Known Good Die (KGD) Benefits– Lower cost method than die level burn-<strong>in</strong>.– Use of KGD flip chips <strong>in</strong> multi-chip modules(MCM), direct chip attach (DCA), and chip-onboard(COB).– Reduction <strong>in</strong> process steps when compared topackaged-level and die-level burn-<strong>in</strong>.– Reduction of wafer test <strong>in</strong>sertion and probe time.– Faster test result feedback to the fab.<strong>BiTS</strong> 2001 <strong>Workshop</strong>T. McKenzie / W. Ballouli / J. Stroupe6
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