Burn-in & Test Socket Workshop - BiTS Workshop

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For Bits 2001 Workshop on Test & Burn-InSOME SCENARIOS ON WAFER-LEVEL TEST & BURN-INRobert Y. MillionMarketing ManagerYamaichi Electronics U.S.A., Inc.1
Chip Scale Packages (CSP)Chip Scale Packages (CSP) have been thedesign darlings of advanced packaging, butstarting last year 1999, the trend is on waferlevelpackaging. The following five areashave seen significant breakthroughs whichcollectively provide a unique technicalfoundation for a new type of electronicspackage:! Copper metallurgy and low dielectricmaterials for IC development! Wafer-level test & burn-in (WLBI)! The use of integrated passives (IPDs)! Design automation tools! Wafer bumping servicesThis presentation will define and describesome of the current technologies whichaddress the issues involving Wafer-level test& burn-in, a key element for the entire backendassembly/test function in IC production.2
Page 1 and 2: Burn-in & TestSocket WorkshopIEEEMa
Page 3: Technical ProgramSession 8Wednesday
Page 6 and 7: KGD Sacrificial Metal WLBI• Defin
Page 8 and 9: Purpose For DevelopingWafer Level B
Page 10 and 11: Wafer Level Burn-in MethodologyPack
Page 13 and 14: 5 inch Wafer Level Burn-In Methodol
Page 15 and 16: 8 inch WLBI MethodologyPost wafer f
Page 17 and 18: 8 inch Wafer Level Burn-In SystemCu
Page 19 and 20: WLBI Design Considerations● Minim
Page 21 and 22: System Design Considerations● Max
Page 23 and 24: Accomplishments•8 inch Wafer Prog
Page 25 and 26: Accomplishments•Reliability Studi
Page 28 and 29: AcknowledgmentsThe authors would li
Page 32: Wafer-Level Test & Burn-InWafer-lev
Page 35 and 36: Became nucleus for such KGD socket/
Page 37 and 38: ! Over 65 different CSP packages fr
Page 39 and 40: MotorolaCurrent Final Manufacturing
Page 41 and 42: MotorolaWLBI Beta Development Syste
Page 43 and 44: MatsushitaMatsushita WLBI System Ov
Page 45 and 46: MatsushitaIn conclusion, a first st
Page 47 and 48: FormFactorThe ultimate extension of
Page 49 and 50: FormFactorThe WOW Process: A Wafer
Page 51 and 52: FormFactorWLBI Clamping and Cooling
Page 53 and 54: GryphicsGryphics®, Inc.In Developm
Page 56 and 57: The following is an example ofsuch
Page 58 and 59: Aehr Test SystemsAehr Test Systems
Page 60 and 61: Aehr Test SystemsThe economics and
Page 62 and 63: Motorola Inc. / SPS GroupSacrificia
Page 64 and 65: Test System Design:Motorola Inc. /
Page 66 and 67: Fixture Design and Contact Technolo
Page 68 and 69: Die Product ConsortiumDie Products
Page 70 and 71: Contributors1. Flynn, Greg W., “W

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