Burn-in & Test Socket Workshop - BiTS Workshop

FormFactorCurrent Projects with Three Alternative Test Flows:! WLBI and Wafer-Level at speed test - demonstratedwith Teradyne Aires tester and Infineon’s Rambus dietested at 800MHz (12x faster than any other waferleveltest reported)! Dicing after CSP packaging at wafer-level and usingexisting CSP handlers and test boards with $10~20Yamaichi sockets (x-y registration frame and lid - themicrospring contact is on the die) instead of high-cost,and high-speed test contactors ($1500~4000).! Package, dice, then assemble into modules - do allburn-in and test at the module level. No underfillrequired which makes repair simple. Since themicrosprings are self-socketing, one can utilize a usea pressure mounted connection and elimininate solderor conductive epoxies altogether.23