Burn-in & Test Socket Workshop - BiTS Workshop

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The following is an example ofsuch controlled compliance finepitch interconnect utilized in thesame probe module for testingand burning-in multiple devicesites:27
GryphicsUsing this approach, a flex circuit exit routingcoming off the probe module can lead to edgecard connection or mate directly to testelectronics:28
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Burn-in & TestSocket WorkshopIEEEMa
Page 3:
Technical ProgramSession 8Wednesday
Page 6 and 7: KGD Sacrificial Metal WLBI• Defin
Page 8 and 9: Purpose For DevelopingWafer Level B
Page 10 and 11: Wafer Level Burn-in MethodologyPack
Page 13 and 14: 5 inch Wafer Level Burn-In Methodol
Page 15 and 16: 8 inch WLBI MethodologyPost wafer f
Page 17 and 18: 8 inch Wafer Level Burn-In SystemCu
Page 19 and 20: WLBI Design Considerations● Minim
Page 21 and 22: System Design Considerations● Max
Page 23 and 24: Accomplishments•8 inch Wafer Prog
Page 25 and 26: Accomplishments•Reliability Studi
Page 28 and 29: AcknowledgmentsThe authors would li
Page 30 and 31: For Bits 2001 Workshop on Test & Bu
Page 32: Wafer-Level Test & Burn-InWafer-lev
Page 35 and 36: Became nucleus for such KGD socket/
Page 37 and 38: ! Over 65 different CSP packages fr
Page 39 and 40: MotorolaCurrent Final Manufacturing
Page 41 and 42: MotorolaWLBI Beta Development Syste
Page 43 and 44: MatsushitaMatsushita WLBI System Ov
Page 45 and 46: MatsushitaIn conclusion, a first st
Page 47 and 48: FormFactorThe ultimate extension of
Page 49 and 50: FormFactorThe WOW Process: A Wafer
Page 51 and 52: FormFactorWLBI Clamping and Cooling
Page 53 and 54: GryphicsGryphics®, Inc.In Developm
Page 58 and 59: Aehr Test SystemsAehr Test Systems
Page 60 and 61: Aehr Test SystemsThe economics and
Page 62 and 63: Motorola Inc. / SPS GroupSacrificia
Page 64 and 65: Test System Design:Motorola Inc. /
Page 66 and 67: Fixture Design and Contact Technolo
Page 68 and 69: Die Product ConsortiumDie Products
Page 70 and 71: Contributors1. Flynn, Greg W., “W
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Burn-in & Test Socket Workshop - BiTS Workshop

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