Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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System Design Considerations● Maximum wafer power dissipation undernatural and forced convection● Effect of heats<strong>in</strong>k thickness and shape● Thermal transfer between wafer and heats<strong>in</strong>k● Inlet air temperature● Airflow speed and circulation pattern● Temperature uniformity across the wafer<strong>BiTS</strong> 2001 <strong>Workshop</strong>T. McKenzie / W. Ballouli / J. Stroupe18
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