Burn-in & Test Socket Workshop - BiTS Workshop

The goal of the Test Methods DemonstrationProject is to demonstrate that wafer level testand stress screening methods are effective forthe acceleration and detection of varioustypes of defects.This project will provide a baseline formembers to compare defectivity of their fabswith other members’ experience on a strictconfidential basis.The Project will develop the tools and provideunderstanding of the industry’s “best practice”,enabling members to determine the most costeffective means to achieve their particularreliability goals.40