Burn-in & Test Socket Workshop - BiTS Workshop

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KGD Sacrificial Metal WLBI• Definition of Known Good Die (KGD)– Die having the same quality and reliability level asthat of an equivalent packaged part.• Definition of Sacrificial Metal (SM)– Metal which is temporarily deposited on a wafer toprovide electrical signal paths to a die andsurrounding die during wafer level burn-in and test.The sacrificial metal is etched away after burn-inand test is complete.BiTS 2001 WorkshopT. McKenzie / W. Ballouli / J. Stroupe3
KGD Sacrificial Metal WLBI• Definition of Wafer Level Burn-In (WLBI)– Simultaneous burn-in of all die on a wafer to screenout marginal devices for infant mortality bydynamically stressing the integrated circuit atelevated temperature and voltage.BiTS 2001 WorkshopT. McKenzie / W. Ballouli / J. Stroupe4
Page 1 and 2: Burn-in & TestSocket WorkshopIEEEMa
Page 3: Technical ProgramSession 8Wednesday
Page 8 and 9: Purpose For DevelopingWafer Level B
Page 10 and 11: Wafer Level Burn-in MethodologyPack
Page 13 and 14: 5 inch Wafer Level Burn-In Methodol
Page 15 and 16: 8 inch WLBI MethodologyPost wafer f
Page 17 and 18: 8 inch Wafer Level Burn-In SystemCu
Page 19 and 20: WLBI Design Considerations● Minim
Page 21 and 22: System Design Considerations● Max
Page 23 and 24: Accomplishments•8 inch Wafer Prog
Page 25 and 26: Accomplishments•Reliability Studi
Page 28 and 29: AcknowledgmentsThe authors would li
Page 30 and 31: For Bits 2001 Workshop on Test & Bu
Page 32: Wafer-Level Test & Burn-InWafer-lev
Page 35 and 36: Became nucleus for such KGD socket/
Page 37 and 38: ! Over 65 different CSP packages fr
Page 39 and 40: MotorolaCurrent Final Manufacturing
Page 41 and 42: MotorolaWLBI Beta Development Syste
Page 43 and 44: MatsushitaMatsushita WLBI System Ov
Page 45 and 46: MatsushitaIn conclusion, a first st
Page 47 and 48: FormFactorThe ultimate extension of
Page 49 and 50: FormFactorThe WOW Process: A Wafer
Page 51 and 52: FormFactorWLBI Clamping and Cooling
Page 53 and 54: GryphicsGryphics®, Inc.In Developm
Page 56 and 57:
The following is an example ofsuch
Page 58 and 59:
Aehr Test SystemsAehr Test Systems
Page 60 and 61:
Aehr Test SystemsThe economics and
Page 62 and 63:
Motorola Inc. / SPS GroupSacrificia
Page 64 and 65:
Test System Design:Motorola Inc. /
Page 66 and 67:
Fixture Design and Contact Technolo
Page 68 and 69:
Die Product ConsortiumDie Products
Page 70 and 71:
Contributors1. Flynn, Greg W., “W
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