Burn-in & Test Socket Workshop - BiTS Workshop

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FormFactorCurrent Projects with Three Alternative Test Flows:! WLBI and Wafer-Level at speed test - demonstratedwith Teradyne Aires tester and Infineon’s Rambus dietested at 800MHz (12x faster than any other waferleveltest reported)! Dicing after CSP packaging at wafer-level and usingexisting CSP handlers and test boards with $10~20Yamaichi sockets (x-y registration frame and lid - themicrospring contact is on the die) instead of high-cost,and high-speed test contactors ($1500~4000).! Package, dice, then assemble into modules - do allburn-in and test at the module level. No underfillrequired which makes repair simple. Since themicrosprings are self-socketing, one can utilize a usea pressure mounted connection and elimininate solderor conductive epoxies altogether.23
GryphicsGryphics®, Inc.In Development: A Controlled Compliance Probewith Generic Applications as a Wafer ProbeAnother Company with quite innovative technologyis Gryphics, Inc., located in Plymouth, MN. Gryphicsis developing a patented group of products whichincorporate low cost and high performance into whatare referred to as Removeable Chip Modules(RCM). These high-density modules can accept awide variety of devices in many applications witheach device being interconnected by a very lowinductance Multi-mode Compliance contact system,which is solderless and demateable.The RCM can be used as a prototyping, test & burnin,and production IC socket as well as productsintegrating removeable ICs into high volumeconnector applications.24
Page 1 and 2: Burn-in & TestSocket WorkshopIEEEMa
Page 3: Technical ProgramSession 8Wednesday
Page 6 and 7: KGD Sacrificial Metal WLBI• Defin
Page 8 and 9: Purpose For DevelopingWafer Level B
Page 10 and 11: Wafer Level Burn-in MethodologyPack
Page 13 and 14: 5 inch Wafer Level Burn-In Methodol
Page 15 and 16: 8 inch WLBI MethodologyPost wafer f
Page 17 and 18: 8 inch Wafer Level Burn-In SystemCu
Page 19 and 20: WLBI Design Considerations● Minim
Page 21 and 22: System Design Considerations● Max
Page 23 and 24: Accomplishments•8 inch Wafer Prog
Page 25 and 26: Accomplishments•Reliability Studi
Page 28 and 29: AcknowledgmentsThe authors would li
Page 30 and 31: For Bits 2001 Workshop on Test & Bu
Page 32: Wafer-Level Test & Burn-InWafer-lev
Page 35 and 36: Became nucleus for such KGD socket/
Page 37 and 38: ! Over 65 different CSP packages fr
Page 39 and 40: MotorolaCurrent Final Manufacturing
Page 41 and 42: MotorolaWLBI Beta Development Syste
Page 43 and 44: MatsushitaMatsushita WLBI System Ov
Page 45 and 46: MatsushitaIn conclusion, a first st
Page 47 and 48: FormFactorThe ultimate extension of
Page 49 and 50: FormFactorThe WOW Process: A Wafer
Page 51: FormFactorWLBI Clamping and Cooling
Page 56 and 57: The following is an example ofsuch
Page 58 and 59: Aehr Test SystemsAehr Test Systems
Page 60 and 61: Aehr Test SystemsThe economics and
Page 62 and 63: Motorola Inc. / SPS GroupSacrificia
Page 64 and 65: Test System Design:Motorola Inc. /
Page 66 and 67: Fixture Design and Contact Technolo
Page 68 and 69: Die Product ConsortiumDie Products
Page 70 and 71: Contributors1. Flynn, Greg W., “W

Burn-in & Test Socket Workshop - BiTS Workshop

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