Burn-in & Test Socket Workshop - BiTS Workshop

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FormFactorFormFactor Inc. - Using MicrospringContacts for Wafer-Level Packaging & TestFormFactor has invented a new contacttechnology called a MicroSpring suited forelectronic applications of a low force, low profile,z-axis, wiping, gold on gold contact.! These are true springs requiring around onegram of compression force for every one mil ofdisplacement and exhibit low contact resistance,typically below 30 milliohm5 per contact pair.! They can be used as a fine pitch contact downto pitches of 225 microns, ie., as in currentproduction of contacting C4 (Flip chip) arrays of1000's of contacts.! They have been profiled as being ideally used inLGA production sockets and have been used inFormFactor’s own Probe Cards to test DRAMsor CPUs at the wafer level.17
FormFactorThe ultimate extension of theirMicroSpring technology comes in the formof their WOW technology or Wafer OnWafer. WOW is the IC industry’s first backendprocess that provides full wafer levelpackage, burn-in, test and module assembly -all steps to be performed on a whole waferthereby reducing costs.The key element in FormFactor’s success isthe MicroSpring contact which is formed byplacing a specifically designed and shapedwire bond at the desired pad or contactlocation, and then plating up with a proprietaryprocess the wirebond, transforming it into aspring.18
Page 1 and 2: Burn-in & TestSocket WorkshopIEEEMa
Page 3: Technical ProgramSession 8Wednesday
Page 6 and 7: KGD Sacrificial Metal WLBI• Defin
Page 8 and 9: Purpose For DevelopingWafer Level B
Page 10 and 11: Wafer Level Burn-in MethodologyPack
Page 13 and 14: 5 inch Wafer Level Burn-In Methodol
Page 15 and 16: 8 inch WLBI MethodologyPost wafer f
Page 17 and 18: 8 inch Wafer Level Burn-In SystemCu
Page 19 and 20: WLBI Design Considerations● Minim
Page 21 and 22: System Design Considerations● Max
Page 23 and 24: Accomplishments•8 inch Wafer Prog
Page 25 and 26: Accomplishments•Reliability Studi
Page 28 and 29: AcknowledgmentsThe authors would li
Page 30 and 31: For Bits 2001 Workshop on Test & Bu
Page 32: Wafer-Level Test & Burn-InWafer-lev
Page 35 and 36: Became nucleus for such KGD socket/
Page 37 and 38: ! Over 65 different CSP packages fr
Page 39 and 40: MotorolaCurrent Final Manufacturing
Page 41 and 42: MotorolaWLBI Beta Development Syste
Page 43 and 44: MatsushitaMatsushita WLBI System Ov
Page 45: MatsushitaIn conclusion, a first st
Page 49 and 50: FormFactorThe WOW Process: A Wafer
Page 51 and 52: FormFactorWLBI Clamping and Cooling
Page 53 and 54: GryphicsGryphics®, Inc.In Developm
Page 56 and 57: The following is an example ofsuch
Page 58 and 59: Aehr Test SystemsAehr Test Systems
Page 60 and 61: Aehr Test SystemsThe economics and
Page 62 and 63: Motorola Inc. / SPS GroupSacrificia
Page 64 and 65: Test System Design:Motorola Inc. /
Page 66 and 67: Fixture Design and Contact Technolo
Page 68 and 69: Die Product ConsortiumDie Products
Page 70 and 71: Contributors1. Flynn, Greg W., “W

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