Burn-in & Test Socket Workshop - BiTS Workshop

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MotorolaWafer-Level Burn-In at Motorola - A JointDevelopment Project between Motorola,Tokyo Electron Ltd.(TEL), and W.L. Gore &Associates! Motorola - process development, integrationand qualification! W.L. Gore - supplying wafer contactormaterials in the form of GoreMateIIContactor and Inferno IC Board! Tokyo Electron Ltd. - supplying burn-inequipment and automation! Project located at BAT-1 (Bump, Assembly,and Test) - Motorola’s integrated back-endfactory in Austin, TX - all operations fromunit probe through final test are under oneroof.9
MotorolaCurrent Final Manufacturing Flow; WLBIAdvantages; and WLBI FinalManufacturing FlowCurrent Final Manufacturing FlowPackaged UnitsKnown Good DieCarrierUnload❏ WLBI Advantages– Product Cost Reduction– Cycle Time Reduction– Capital Cost ReductionWLBI Final Manufacturing FlowPackaged UnitsKnown Good DiePackageBurn-inTestCarrierBurn-inTestAssemblyTestAssemblyTestCarrierLoadDicingWafer ProbeDicingWafer ProbeWaferLevelBurn-in10
Page 1 and 2: Burn-in & TestSocket WorkshopIEEEMa
Page 3: Technical ProgramSession 8Wednesday
Page 6 and 7: KGD Sacrificial Metal WLBI• Defin
Page 8 and 9: Purpose For DevelopingWafer Level B
Page 10 and 11: Wafer Level Burn-in MethodologyPack
Page 13 and 14: 5 inch Wafer Level Burn-In Methodol
Page 15 and 16: 8 inch WLBI MethodologyPost wafer f
Page 17 and 18: 8 inch Wafer Level Burn-In SystemCu
Page 19 and 20: WLBI Design Considerations● Minim
Page 21 and 22: System Design Considerations● Max
Page 23 and 24: Accomplishments•8 inch Wafer Prog
Page 25 and 26: Accomplishments•Reliability Studi
Page 28 and 29: AcknowledgmentsThe authors would li
Page 30 and 31: For Bits 2001 Workshop on Test & Bu
Page 32: Wafer-Level Test & Burn-InWafer-lev
Page 35 and 36: Became nucleus for such KGD socket/
Page 37: ! Over 65 different CSP packages fr
Page 41 and 42: MotorolaWLBI Beta Development Syste
Page 43 and 44: MatsushitaMatsushita WLBI System Ov
Page 45 and 46: MatsushitaIn conclusion, a first st
Page 47 and 48: FormFactorThe ultimate extension of
Page 49 and 50: FormFactorThe WOW Process: A Wafer
Page 51 and 52: FormFactorWLBI Clamping and Cooling
Page 53 and 54: GryphicsGryphics®, Inc.In Developm
Page 56 and 57: The following is an example ofsuch
Page 58 and 59: Aehr Test SystemsAehr Test Systems
Page 60 and 61: Aehr Test SystemsThe economics and
Page 62 and 63: Motorola Inc. / SPS GroupSacrificia
Page 64 and 65: Test System Design:Motorola Inc. /
Page 66 and 67: Fixture Design and Contact Technolo
Page 68 and 69: Die Product ConsortiumDie Products
Page 70 and 71: Contributors1. Flynn, Greg W., “W

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