11.07.2015 Views

Burn-in & Test Socket Workshop - BiTS Workshop

Burn-in & Test Socket Workshop - BiTS Workshop

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Wafer-Level <strong>Test</strong> & <strong>Burn</strong>-InWafer-level test & burn-<strong>in</strong> = the ‘ultimate<strong>in</strong>terconnect’? Why? Some significantobstacles to overcome <strong>in</strong> realiz<strong>in</strong>g a trulyviable Wafer-level test & burn-<strong>in</strong> system:! A lot of Z-axis bumps and high-density<strong>in</strong>terconnects! CTE match<strong>in</strong>g of contactor to silicon underhigh temperature for long duration! Heavy loads or high-forces to makeelectrical connection! Uniform forces to all of the bumps orcoplanarity issues! A low cost contactor systemThese obstacles only relevant to probe orcontactor portion - just first step towardspractical WLBI system. Subsequently, wehave other issues:3

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