Burn-in & Test Socket Workshop - BiTS Workshop

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Motorola Inc. / SPS GroupSacrificial Metal Wafer Level Burn-in KGDMotorola has been developing and evaluating WLBItechnologies since the early ‘90s as seen in the earlierpresentation on the Motorola/TEL/Gore alliance. Thisparticular development and implementation of 127mmand 200mm Sacrificial Metal Wafer Level Burn-In KGD atMotorola is a strategic enabling technology that allowsMotorola to maintain a competitive edge in the electronicpersonal communications, computer and automotivemarketplace.This has been a joint effort between teams at:! Motorola Austin - TSG (Transportation Systems Group)! Motorola Chandler - SMD (Strategic ManufacturingDeployment)! Motorola Chandler - MOS 12 Group33
Motorola Inc. / SPS GroupThe WLBI process flow at the wafer-level:! WLBI process flow is identical to packagelevel devices all the way to Metal-3 at theMOS! The special passivation mask enable contactalong the scribe grid whose contactsaccommodate excercising of the deviceduring burn-in! A final polyimide over-layer acts as a stressbuffer in aggressive environments (ie.,automotive) - need to be free of unstablecomponents to prevent outgassing! Wafer-level burn-in circuit removalcomprised of wet etch processes withchemistries identical to that used in definingthe WLBI circuit - TiW and/or Cu must becompletely removed34
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Burn-in & TestSocket WorkshopIEEEMa
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Technical ProgramSession 8Wednesday
Page 6 and 7:
KGD Sacrificial Metal WLBI• Defin
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Purpose For DevelopingWafer Level B
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Wafer Level Burn-in MethodologyPack
Page 13 and 14: 5 inch Wafer Level Burn-In Methodol
Page 15 and 16: 8 inch WLBI MethodologyPost wafer f
Page 17 and 18: 8 inch Wafer Level Burn-In SystemCu
Page 19 and 20: WLBI Design Considerations● Minim
Page 21 and 22: System Design Considerations● Max
Page 23 and 24: Accomplishments•8 inch Wafer Prog
Page 25 and 26: Accomplishments•Reliability Studi
Page 28 and 29: AcknowledgmentsThe authors would li
Page 30 and 31: For Bits 2001 Workshop on Test & Bu
Page 32: Wafer-Level Test & Burn-InWafer-lev
Page 35 and 36: Became nucleus for such KGD socket/
Page 37 and 38: ! Over 65 different CSP packages fr
Page 39 and 40: MotorolaCurrent Final Manufacturing
Page 41 and 42: MotorolaWLBI Beta Development Syste
Page 43 and 44: MatsushitaMatsushita WLBI System Ov
Page 45 and 46: MatsushitaIn conclusion, a first st
Page 47 and 48: FormFactorThe ultimate extension of
Page 49 and 50: FormFactorThe WOW Process: A Wafer
Page 51 and 52: FormFactorWLBI Clamping and Cooling
Page 53 and 54: GryphicsGryphics®, Inc.In Developm
Page 56 and 57: The following is an example ofsuch
Page 58 and 59: Aehr Test SystemsAehr Test Systems
Page 60 and 61: Aehr Test SystemsThe economics and
Page 64 and 65: Test System Design:Motorola Inc. /
Page 66 and 67: Fixture Design and Contact Technolo
Page 68 and 69: Die Product ConsortiumDie Products
Page 70 and 71: Contributors1. Flynn, Greg W., “W
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Burn-in & Test Socket Workshop - BiTS Workshop

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