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Prospects of Colloidal Nanocrystals for Electronic - Computer Science

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<strong>Colloidal</strong> <strong>Nanocrystals</strong> in <strong>Electronic</strong> Applications Chemical Reviews, 2010, Vol. 110, No. 1 417<br />

Table 2. Reported Electron and Hole Mobilities <strong>for</strong> Various NC Films a<br />

material<br />

ligand/sample<br />

treatment particle size (nm)<br />

<strong>of</strong> the melting temperature <strong>of</strong> metals and semiconductors can<br />

exceed 1000 °C, allowing one to sinter very small (∼2 nm)<br />

NCs at temperatures below 300 °C (Figure 33).<br />

The ability <strong>of</strong> NCs to fuse at relatively modest temperatures<br />

provides a low-temperature route to thin-film growth.<br />

This approach has been successfully utilized <strong>for</strong> <strong>for</strong>mation<br />

<strong>of</strong> metallic (Au, 391 Ag 392 ) and semiconducting (CdS, 389<br />

CdSe, 268 HgTe 298 ) thin films with good electrical conductivity.<br />

However, a serious limitation <strong>of</strong> this approach is<br />

associated with the presence <strong>of</strong> organic ligands at the<br />

nanoparticle surface, necessary to stabilize particles in<br />

solution. These ligand molecules <strong>of</strong>ten partially destroy and<br />

carbonize during the sintering process, contaminating semiconducting<br />

materials and reducing size <strong>of</strong> crystalline grains.<br />

As a result, carrier mobility in semiconducting films obtained<br />

by sintering <strong>of</strong> corresponding nanoparticles is much lower<br />

electron mobility<br />

(cm 2 /V · s)<br />

hole mobility<br />

(cm 2 /V · s)<br />

than the mobility <strong>of</strong> CVD-grown thin films. For example,<br />

the reported electron mobility in CdSe thin films derived from<br />

2 nm nanoparticles sintered at 350 °Cwas1cm 2 /(V s), more<br />

than 2 orders <strong>of</strong> magnitude lower than the mobilities in<br />

vapor-deposited CdSe films. 268 The further improvement<br />

should be possible by designing special surface ligands,<br />

which can be reliably removed from the nanoparticle surface<br />

without leaving any solid residue behind.<br />

7. Nanocrystal Devices<br />

measurement<br />

technique ref<br />

CdSe HT 1 FET 268<br />

charge injection 6.4 0.8 × 10-2 El-Chem 185<br />

K doping 5.4 3 × 10-6 El-Chem 185<br />

2.7-5.0 10-4-10-6 SCLC 346<br />

ZnO 0.1 El-Chem 351<br />

HT 6.0 2.4 × 10-4 (µlin)<br />

4.6 × 10<br />

FET 386<br />

-4 HgTe HT<br />

(µsat)<br />

0.82 (BG)<br />

2.38 (TG)<br />

FET 298<br />

CdTe/CdHgTe HT 0.21 (BG)<br />

0.026 (TG)<br />

FET 387<br />

PbS N2H4<br />

ethanedithiol<br />

7.1<br />

5<br />

0.08 (µlin)<br />

0.12 (µsat)<br />

1 × 10<br />

FET 24<br />

-4 FET 380<br />

PbSe N2H4<br />

N2H4<br />

butylamine<br />

8.1<br />

9.2<br />

5.7<br />

0.4 (µlin)<br />

0.95 (µsat)<br />

0.5-1.2<br />

7.4<br />

0.12-0.18 FET<br />

FET<br />

THz spectroscopy<br />

23<br />

25<br />

385<br />

N2H4<br />

29.4<br />

NaOH 35<br />

ethylenediamine 47<br />

HT 4 × 10 -5 FET 330<br />

PbTe N2H4 0.95 0.15 FET 357<br />

a Abbreviations: HT, heat treatment; N2H4, hydrazine treatement; BG, back gate; TG, top gate; FET, field-effect transistor measurements; El-<br />

Chem, electrochemical measurements; THz, terahertz spectroscopy measurements; SCLC, space-charge limited current model.<br />

Figure 33. Size-dependence <strong>of</strong> the melting temperature <strong>for</strong> (a) Au and (b) CdS nanoparticles. (a) Reprinted with permission from ref 389.<br />

Copyright 1976 American Institute <strong>of</strong> Physics. (b) Reprinted with permission from ref 390. Copyright 1992 American Association <strong>for</strong><br />

Advancement <strong>of</strong> <strong>Science</strong>.<br />

Examples <strong>of</strong> NC devices include photoresistors, diodes<br />

with rectifying I-V characteristic, field-effect transistors,<br />

memory elements, light-emitting and photovoltaic devices,<br />

etc. All <strong>of</strong> these have been recently assembled from<br />

chemically synthesized metal and semiconductor NCs.

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