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Prospects of Colloidal Nanocrystals for Electronic - Computer Science

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442 Chemical Reviews, 2010, Vol. 110, No. 1 Talapin et al.<br />

at low voltages even when the oxide thickness was slightly<br />

thicker than that <strong>for</strong> SiO2 tunneling oxide memory.<br />

Metal Nanocrystal-Based Flash Memory Devices. Recently,<br />

it was realized that flash memory devices using metal<br />

NCs as floating gates can be superior to the devices utilizing<br />

semiconductor NCs. 576-578,586-589,591,608-611 The advantages <strong>of</strong><br />

metal NCs <strong>for</strong> memory applications are higher density <strong>of</strong><br />

states near the Fermi level, stronger electrostatic coupling<br />

to the conducting channel, tunable work function, and small<br />

energy perturbations due to carrier confinement. The work<br />

function can be tuned by using different metals and metal<br />

alloys <strong>of</strong>fering an opportunity to optimize the trade-<strong>of</strong>f<br />

between write/erase speed and charge retention because the<br />

work function <strong>of</strong> NC FGs controls not only the depth <strong>of</strong> the<br />

potential well at the storage node but also the density <strong>of</strong> states<br />

available <strong>for</strong> carrier tunneling. Numerous attempts have been<br />

made to develop nonvolatile memory devices using <strong>for</strong> FG<br />

metal NCs such as Au, Pt, Ni, Co, Ag, etc. 589,591,592 So far,<br />

Au is one <strong>of</strong> the most promising materials because it is<br />

chemically stable and has a large work function. Isolated<br />

Au NCs <strong>for</strong>m a deep quantum well between the control oxide<br />

and tunnel oxide, desirable <strong>for</strong> the FG application.<br />

For example, Chan et al. reported the memory characteristics<br />

<strong>of</strong> Au NCs embedded in the amorphous HfAlO tunnel<br />

layer. 587 A significant threshold voltage shift was obtained<br />

due to charge trapping on Au NCs. The memory window<br />

and stored charge density were ∼10 V and ∼1 × 10 14 /cm 2 ,<br />

respectively. A smaller size <strong>of</strong> Au NCs showed a higher<br />

tunneling coefficient and a larger memory window. Lo et<br />

al. reported charge storage characteristics <strong>of</strong> Au NCs on the<br />

multistacked layer <strong>of</strong> Al2O3/HfO2/SiO2. 588 The device showed<br />

high efficiencies <strong>of</strong> charge injection and detrapping with long<br />

retention times. There are several good review articles on<br />

metal NCs-based memory devices. 589,591,592,612,613<br />

All above-described devices employed metal and semiconductor<br />

NCs deposited from the gas phase using CVD or<br />

high-vacuum deposition techniques. Such processes typically<br />

have difficulties with controlling NC size and packing<br />

density. In addition, high temperature processes <strong>for</strong> making<br />

NCs can provide a source <strong>of</strong> metallic contamination due to<br />

diffusion <strong>of</strong> metal atoms into FET channel. <strong>Colloidal</strong><br />

synthesis <strong>of</strong> NCs provides a convenient opportunity to<br />

overcome many problems <strong>of</strong> gas-phase NC growth. It can<br />

easily provide monodisperse NCs <strong>of</strong> different materials with<br />

precisely tunable size. The NCs can be integrated into the<br />

memory device using low temperature solution processing.<br />

Recently, memory devices using colloidal NCs as chargetrapping<br />

elements have been reported. 614-622 Park et al.<br />

reported the memory effects <strong>for</strong> colloidal gold NCs embedded<br />

between thermally grown SiO2 tunnel oxide and Al2O3<br />

control oxide deposited by atomic layer deposition (ALD). 622,623<br />

To characterize the memory behavior, they measured the<br />

dependence <strong>of</strong> capacitance versus DC bias applied to Al/<br />

Al2O3(60 nm)/Au_NCs /SiO2(6.3 nm)/p-Si metal-oxidesemiconductor<br />

(MOS) capacitor. Because MOS capacitor<br />

represents the gate stack <strong>of</strong> a flash memory device, such<br />

capacitance measurements allow modeling the memory<br />

behavior using a simple device structure with only passive<br />

elements, without building an active MOSFET-based memory<br />

cell. The write and erase cycles are represented by shifts in<br />

the flat-band voltage <strong>of</strong> MOS capacitor, directly related to<br />

the threshold voltage <strong>of</strong> flash memory FET. 622 The C-V<br />

curves <strong>of</strong> MOS capacitor with embedded Au NCs showed a<br />

flat-band voltage shift <strong>of</strong> about 4.3 V depending on the bias<br />

Figure 58. (a) Capacitance versus applied bias curves <strong>for</strong> MOS<br />

capacitors with or without embedded chemically synthesized Au<br />

nanoparticles. (b) Storage <strong>of</strong> charges trapped in Au nanoparticles<br />

embedded between tunnel and control oxide layers. Reprinted with<br />

permission from ref 622. Copyright 2006 Institute <strong>of</strong> Physics.<br />

history (Figure 58a). This shift originated from the trapping<br />

<strong>of</strong> charge carriers on Au NCs. The estimated number <strong>of</strong><br />

charge carriers stored in the Au NCs was about 3 × 10 11<br />

cm -2 when the voltage was swept in the range <strong>of</strong> (7 V.<br />

The device also showed relatively good retention time, after<br />

losing ∼18% <strong>of</strong> initial charge during the first 500 s,<br />

remaining charge stabilized with ∼2% additional decay after<br />

10 4 s (Figure 58b).<br />

Choi et al. reported the FG memory device using colloidally<br />

synthesized 4 nm Pt NCs. 624 The monolayer <strong>of</strong> Pt NCs<br />

was immobilized on a SiO2 substrate using poly(4-vinylpyridine)<br />

as a surface modifier. A MOS-type memory device<br />

with Pt NCs exhibited a relatively large memory window <strong>of</strong><br />

5.8 V under (7 V <strong>for</strong> write/erase voltage. Lee et al.<br />

demonstrated the possibility to tune the properties <strong>of</strong> chargetrapping<br />

layer by utilizing binary mixtures <strong>of</strong> NCs with<br />

different electron affinities (Co and Au). 625 All <strong>of</strong> these results<br />

indicate that chemically synthesized metal NCs can be<br />

successfully integrated in nonvolatile flash memory devices.<br />

The concept <strong>of</strong> charge-trapping memory can also be<br />

realized by integrating colloidal NCs into a matrix <strong>of</strong> organic<br />

insulator. Thus, Lee et al. demonstrated hysteresis in C-V<br />

curves measured <strong>for</strong> a metal-insulator-semiconductor<br />

(MIS) capacitor with the insulating layer composed <strong>of</strong><br />

polyelectrolyte/Au NCs multilayer films. 619 These chargetrapping<br />

insulating films were prepared by the layer-by-layer

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