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the working temperature range thus Eq. (3.62) is simplified as a constant value of<br />

0.2205°C /W for the conductive thermal resistance R C 23 .<br />

Figure VIII. 19 Chamber wall 2 and 3 conductive and outer surface resistance subsystem<br />

VIII.4 In-chamber air specific humidity calculation subsystem<br />

This subsystem is created for calculating the specific humidity of air in the chamber. It<br />

is actually a calculation of the mixing of the inlet and the evaporated water vapour. It is<br />

d m m<br />

<br />

C ev<br />

based on Eq. (3.66) i.e. Ca<br />

m<br />

C<br />

d<br />

. However, when the flow rate is near zero,<br />

the calculated specific humidity level from Eq. (3.66) is extraordinarily high. This<br />

makes the result unreal and the model stuck. In fact the change of total vapour amount<br />

in the chamber is far from so significant as the calculated result since the extremity<br />

occurs only when flow rate is very small. To get rid of the influence of such unreal<br />

calculated result, a saturation-control subsystem is placed after this subsystem to curb<br />

the result no more than saturation level. Thus this subsystem contains two subsystems.<br />

One is for calculating the specific humidity of in-chamber air after such mixing and<br />

another following this is the humidity-level curbing subsystem using saturation<br />

controlling. They are shown below.<br />

Figure VIII. 20 In-chamber air specific humidity calculation subsystem<br />

216

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