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Where Gr is Grashof number and Pr is Prandtl number, the volumetric expansion<br />

coefficient of the fluid and the kinetic viscosity of the fluid.<br />

Values of and are evaluated at interface film temperature which is defined as [50]:<br />

The average Rayleigh number for this interface is<br />

T<br />

f<br />

Ts Tfl<br />

(3.15)<br />

2<br />

46<br />

6<br />

5.462 10 [19]. This<br />

gives C 0.54 and n 1/ 4 for fluid above hot plate [47] (see Appendix XIX for values<br />

of C and n of different situations). Thus, Eq. (3.11) can be rewritten as:<br />

R<br />

Bwn<br />

1<br />

<br />

k A g ( T T<br />

)<br />

0.54 [ Pr ]<br />

w Bw w<br />

3<br />

Bw CBu w<br />

Bw<br />

2<br />

w<br />

Where w , w and Prw are evaluated at the film temperature<br />

for circular interface [50].<br />

The total resistance from heating plate to the water bottom is:<br />

R<br />

Hpw<br />

w Bw w<br />

3<br />

Bw CBu w<br />

Bw<br />

2<br />

w<br />

w<br />

1 4<br />

TCBu Tw<br />

1<br />

0.00954 <br />

k A g ( T T<br />

)<br />

0.54 [ Pr ]<br />

2<br />

w<br />

1 4<br />

(3.16)<br />

D<br />

while<br />

Bw <br />

4<br />

(3.17)<br />

Where the value 0.00954 is the thermal resistance from the heating plate top to the<br />

chamber base top as shown in Table 3.1.<br />

The average thermal resistance from heating plate top to the water (including the<br />

interface between the chamber base and water) is 0.2711K/W [19]. Thus the chamber<br />

base upper surface temperature can be calculated based on the ratio below:<br />

T T<br />

Hp CBu<br />

T T<br />

Hp W<br />

0.00954<br />

<br />

0.035<br />

(3.18)<br />

0.2711<br />

This shows that the chamber base upper surface temperature is close to the heating plate<br />

temperature. Thus, TCBu is assumed the same asTHp which will be discussed below.<br />

Bw

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