Single-Chip Low Cost Low Power RF-Transceiver (Rev. A)

CC250032.1 Recommended PCB layout for package (QLP 20)Figure 30: Recommended PCB layout for QLP 20 packageNote: The figure is an illustration only and not to scale. There are five 10 mil diameter via holesdistributed symmetrically in the ground pad under the package. See also the CC2500EMreference design.32.2 Package thermal propertiesThermal resistanceAir velocity [m/s] 0Rth,j-a [K/W] 40.4Table 39: Thermal properties of QLP 20 package32.3 Soldering informationThe recommendations for lead-free reflow in IPC/JEDEC J-STD-020C should be followed.32.4 Tray specificationCC2500 can be delivered in standard QLP 4x4 mm shipping trays.Tray SpecificationPackage Tray Width Tray Height Tray Length Units per TrayQLP 20 135.9 mm 7.62 mm 322.6 mm 490Table 40: Tray specificationPRELIMINARY Data Sheet (Rev.1.2) SWRS040A Page 79 of 83