MC9S12VR-Family - Data Sheet - Freescale Semiconductor

MCU Electrical Specifications
Table A-7. Thermal Package Characteristics 1
Num C Rating Symbol Min Typ Max Unit
1 D
LQFP 32
Thermal resistance LQFP 32, single sided PCB 1
2 D Thermal resistance LQFP 32, double sided PCB
with 2 internal planes 2
10 D Junction to Case (Bottom) LQFP 48
1
Junction to ambient thermal resistance, θJA was simulated to be equivalent to the JEDEC specification JESD51-2 in a
horizontal configuration in natural convection.
2 Junction to ambient thermal resistance, θJA was simulated to be equivalent to the JEDEC specification JESD51-7 in a
horizontal configuration in natural convection.
3 Junction to ambient thermal resistance, θJA was simulated to be equivalent to the JEDEC specification JESD51-2 in a
horizontal configuration in natural convection.
4
Junction to ambient thermal resistance, θJA was simulated to be equivalent to the JEDEC specification JESD51-7 in a
horizontal configuration in natural convection.
5 ΨJT — 5 — °C/W
MC9S12VR Family Reference Manual, Rev. 2.8
θ JA — 85 — °C/W
θ JA — 56 — °C/W
3 D Junction to Board LQFP 32 θJB — 33 — °C/W
4 D Junction to Case LQFP 32 4
θJC — 23 — °C/W
5 D Junction to Case (Bottom) LQFP 32 5
ΨJT — 5 — °C/W
6 D
LQFP 48
Thermal resistance LQFP 48, single sided PCB 3
7 D Thermal resistance LQFP 48, double sided PCB
with 2 internal planes 4
θ JA — 80 — °C/W
θ JA — 56 — °C/W
8 D Junction to Board LQFP 48 θ JB — 34 — °C/W
9 D Junction to Case LQFP 48 4 θ JC — 23 — °C/W
1. The values for thermal resistance are achieved by package simulations
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