MC9S12VR-Family - Data Sheet - Freescale Semiconductor

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ATD Electrical Specifications C.3.2 ATD Analog Input Parasitics VDDA PAD0- PAD5 VSSA T jmax =130 o C Figure C-2. ATD Input Parasitics I leakp < 0.5µA I leakn < 0.5µA sampling time is 4 to 24 adc clock cycles of 0.25MHz to 8MHz -> 96µs >= tsample >= 500ns 920Ω < R path < 9.9KΩ (incl parasitics) MC9S12VR Family Reference Manual, Rev. 2.8 3.7pF < S/H Cap < 6.2pF (incl parasitics) C bottom Switch resistance depends on input voltage, corner ranges are shown. Leakage current is guaranteed by specification. connected to low ohmic supply during sampling Complete 10bit conversion takes between 19 and 41 adc clock cycles 528 Freescale Semiconductor C top C top potential just prior to sampling is either a) ~ last converted channel potential or b) ground level if S/H discharge feature is enabled.
Appendix D HSDRV Electrical Specifications This section provides electrical parametric and ratings for the HSDRV. D.1 Operating Characteristics Table D-1. Operating Characteristics - HSDRV MC9S12VR Family Reference Manual, Rev. 2.8 HSDRV Electrical Specifications -40˚C ≤ T J ≤ 150˚C 1 unless otherwise noted. Typical values noted reflect the approximate parameter mean at T A = 25˚C 2 under nominal conditions unless otherwise noted. Num C Ratings Symbol Min Typ Max Unit 1 P High Voltage Supply for the high-side drivers. V SUPHS 7 – 42 V 2 T VSUP_HS in case of being connected to VDDX V SUPHS_X 4.5 – 5.5 V 1 TJ : Junction Temperature 2 TA : Ambient Temperature D.2 Static Characteristics Table D-2. Static Characteristics - HSDRV Characteristics noted under conditions 7V ≤ VSUPHS ≤ 18 V, -40˚C ≤ T J ≤ 150˚C 1 unless otherwise noted. Typical values noted reflect the approximate parameter mean at T A = 25˚C 2 under nominal conditions unless otherwise noted. Num C Ratings Symbol Min Typ Max Unit 1 P Output Drain-to-Source On Resistance T J = 150˚C, I PHS0/1 = 50 mA 2 P Output Over-Current Threshold. The threashold is valid for each HS-driver output. Note: The high-side driver is NOT intended to switch capacitive loads. A significant capacitive load on PHS0/1 would induce a current when the high-side driver gate is turned on. This current will be sensed by the over-current circuitry and eventually lead to an immediate over-current shut down. 3 T Nominal Current for continuous operation. This value is valid for each HS-driver output. R DS(ON) – – 18.0 Ω I LIMHSX 90 120 150 mA I NOMHSX – – 50 mA Freescale Semiconductor 529
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MC9S12VR-Family Reference Manual S1
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Chapter 1 Device Overview MC9S12VR-
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2.3.34 Port L Analog Access Registe
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5.2 External Signal Description . .
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Chapter 9 Pulse-Width Modulator (S1
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12.4.6 Gated Time Accumulation Mode
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16.1.2 Modes of Operation . . . . .
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Appendix H LSDRV Electrical Specifi
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1.3 Chip-Level Features Feature MC9
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1.4.4 Main External Oscillator (XOS
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• Programmable polarity for trans
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1.5 Block Diagram PE0 PE1 VSUP VSS
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Address Module NOTE Reserved regist
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1.6.1 Part ID Assignments MC9S12VR
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1.7.2.7 PS[5:0] — Port S I/O Sign
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1.7.2.21 IOC[3:0] Signals MC9S12VR
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1.8.1 Pinout 48-pin LQFP LGND LIN (
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Package Function 48 LQ FP 32 LQ FP
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1.9 Modes of Operation MC9S12VR Fam
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1.11.2 Interrupt Vectors MC9S12VR F
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MC9S12VR Family Reference Manual, R
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Chapter 2 Port Integration Module (
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Port Pin Name 2.3 Memory Map and Re
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Global Address 0x0243 Reserved 0x02
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Global Address 0x0272 Reserved 0x02
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2.3.3 Port E Data Register (PORTE)
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1 Read: Anytime Write: Anytime Tabl
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2.3.10 Port T Data Register (PTT) M
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2.3.12 Port T Data Direction Regist
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2.3.15 Module Routing Register 0 (M
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Table 2-16. PTS Register Field Desc
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2.3.19 Port S Data Direction Regist
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2.3.21 Port S Polarity Select Regis
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MODRR20 MODRR21 TXD0 0 1 1 0 LPTXD
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Table 2-24. PTP Register Field Desc
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2.3.26 Port P Data Direction Regist
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2.3.29 Port P Polarity Select Regis
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2.3.32 Port L Input Register (PTIL)
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3 PTAENL 1-0 PTAL Table 2-34. PTAL
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2.3.37 Port L Interrupt Enable Regi
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2.3.41 Port AD Data Direction Regis
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2.3.44 Port AD Interrupt Enable Reg
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2.4.3.4 Port S MC9S12VR Family Refe
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Glitch, filtered out, no interrupt
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110K / 550K PIRL=0 / PIRL=1 HV Supp
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Chapter 3 S12G Memory Map Controlle
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3.2 External Signal Description Fig
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Read: Anytime. Write: Only if a tra
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3.3.2.4 Program Page Index Register
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0x0000 0x0400 0x8000 0xC000 0xFFFF
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Chapter 4 S12 Clock, Reset and Powe
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4.1.3 S12CPMU_UHV Block Diagram VSU
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4.2 Signal Description MC9S12VR Fam
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4.3 Memory Map and Registers MC9S12
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4.3.2 Register Descriptions MC9S12V
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Table 4-5. CPMUCLKS Descriptions Fi
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4.3.2.7 S12CPMU_UHV PLL Control Reg
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RTR[3:0] 0000 (÷1) 000 (OFF) OFF 1
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4.3.2.9 S12CPMU_UHV COP Control Reg
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Table 4-14. COP Watchdog Rates if C
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4.3.2.14 Low Voltage Control Regist
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APIES=0 APIES=1 MC9S12VR Family Ref
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4.3.2.18 Reserved Register CPMUTEST
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frequency MC9S12VR Family Reference
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4.3.2.23 Reserved Register CPMUTEST
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4.4.6 System Clock Configurations 4
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Chapter 5 Background Debug Module (
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5.1.3 Block Diagram A block diagram
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Global Address Register Name 0x3_FF
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Register Global Address 0x3_FF06 Fi
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• Hardware BACKGROUND command •
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5.4.5 BDM Command Structure Table 5
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Hardware Read Hardware Write Firmwa
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BDM Clock (Target MCU) Host Drive t
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5.4.9 SYNC — Request Timed Refere
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Chapter 6 S12S Debug Module (S12SDB
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• 4-stage state sequencer for tra
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Address: 0x0021 Reset POR Read: Any
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6.3.2.4 Debug Control Register2 (DB
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6.3.2.6 Debug Count Register (DBGCN
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6.3.2.7.1 Debug State Control Regis
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6.3.2.7.3 Debug State Control Regis
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Address: 0x0028 Read: DBGACTL if CO
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6.3.2.8.2 Debug Comparator Address
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6.3.2.8.6 Debug Comparator Data Low
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6.4.2.1.2 Comparator B MC9S12VR Fam
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RTI ; The execution flow taking int
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Field2 Bits in Normal and Loop1 Mod
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6.5.6 Scenario 5 MC9S12VR Family Re
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Chapter 7 Interrupt Module (S12SINT
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7.2 External Signal Description The
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Chapter 8 Analog-to-Digital Convert
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8.1.2 Modes of Operation 8.1.2.1 Co
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8.2 Signal Description This section
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8.3.2.3 ATD Control Register 2 (ATD
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Table 8-15. Analog Input Channel Se
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3-0 CC[3:0] 8.3.2.8 ATD Compare Ena
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8.3.2.10 ATD Input Enable Register
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8.3.2.12.2 Right Justified Result D
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Chapter 9 Pulse-Width Modulator (S1
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9.3 Memory Map and Register Definit
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Register Name 0x0016 PWMPER2 2 0x00
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9.3.2.2 PWM Polarity Register (PWMP
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9.3.2.6 PWM Control Register (PWMCT
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Module Base + 0x00006 Read: Anytime
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9.3.2.10 PWM Channel Counter Regist
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• The channel is disabled MC9S12V
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Divide by Prescaler Taps: Bus Clock
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9.4.2 PWM Channel Timers MC9S12VR F
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9.4.2.6 Center Aligned Outputs MC9S
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Clock Source 7 Clock Source 5 Clock
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• For channels 0, 1, 4, and 5 the
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Chapter 10 Serial Communication Int
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10.1.4 Block Diagram MC9S12VR Famil
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10.3.2 Register Descriptions MC9S12
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10.3.2.2 SCI Control Register 1 (SC
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10.3.2.3 SCI Alternative Status Reg
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10.3.2.5 SCI Alternative Control Re
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10.3.2.7 SCI Status Register 1 (SCI
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10.3.2.8 SCI Status Register 2 (SCI
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10.4 Functional Description MC9S12V
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10.4.3 Data Format MC9S12VR Family
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10.4.5 Transmitter Bus Clock SBR12:
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10.4.5.5 LIN Transmit Collision Det
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10.4.6.5.2 Fast Data Tolerance MC9S
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10.5.3.1 Description of Interrupt O
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Chapter 11 Serial Peripheral Interf
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SPI Interrupt Request Bus Clock SPI
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11.3.2 Register Descriptions MC9S12
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Table 11-4. SPICR2 Field Descriptio
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5 SPTEF 4 MODF Table 11-8. SPISR Fi
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Receive Shift Register SPIF SPI Dat
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11.4.3.1 Clock Phase and Polarity C
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NOTE Care must be taken when expect
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Chapter 12 Timer Module (TIM16B8CV3
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12.1.3 Block Diagrams PA input inte
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PULSE ACCUMULATOR CHANNEL 7 OUTPUT
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Register Name 0x000E TFLG1 1 0x000F
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12.3.2.3 Output Compare 7 Mask Regi
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Write: Anytime. 12.3.2.10 Timer Int
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NOTE The newly selected prescale fa
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12.3.2.15 16-Bit Pulse Accumulator
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... MC9S12VR Family Reference Manua
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12.4.1 Prescaler MC9S12VR Family Re
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12.4.5 Event Counter Mode MC9S12VR
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Chapter 13 High-Side Drivers - HSDR
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13.2 External Signal Description Ta
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13.3.2 Register Definition 13.3.3 P
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13.3.5 Reserved Register MC9S12VR F
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13.3.8 HSDRV Interrupt Flag Registe
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13.4.4.1 HSDRV Over Current Interru
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Chapter 14 Low-Side Drivers - LSDRV
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14.2 External Signal Description Ta
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14.3.2 Register Definition 14.3.3 P
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14.3.5 Reserved Register MC9S12VR F
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14.3.7 LSDRV Status Register (LSSR)
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14.3.9 LSDRV Interrupt Flag Registe
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14.4.4.1 LSDRV Over Current Interru
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Chapter 15 LIN Physical Layer (S12L
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IP-BUS LPRXD LPTXD Figure 15-1. LIN
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15.3 Memory Map and Register Defini
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15.3.2.2 LIN Control Register (LPCR
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7 LPSLRWD 1-0 LPSLR[1:0] 15.3.2.5 R
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15.3.2.7 LIN Interrupt Enable Regis
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NOTE For 20kBit/s and Fast Mode com
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15.4.3.2 Normal Mode MC9S12VR Famil
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15.5.2 Use Cases 15.5.2.1 LIN Physi
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Chapter 16 Supply Voltage Sensor -
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16.3.2.1 BATS Module Enable Registe
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16.3.2.2 BATS Module Status Registe
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16.3.2.5 Reserved Register NOTE The
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Chapter 17 64 KByte Flash Module (S
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17.1.2.3 Other Flash Module Feature
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P-Flash Memory Map Global Address S
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Address & Name 0x0003 FRSV0 0x0004
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6 FDIVLCK 5-0 FDIV[5:0] 17.3.2.2 Fl
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The security function in the Flash
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Offset Module Base + 0x0005 All ass
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Table 17-15. FERSTAT Field Descript
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Table 17-19. P-Flash Protection Low
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Scenario FLASH START 0x3_8000 0x3_F
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Page 477 and 478: 011 100 101 17.3.2.12 Flash Reserve
Page 479 and 480: 17.3.2.17 Flash Reserved5 Register
Page 483 and 484: FCCOB Availability Check Clock Divi
Page 485 and 486: 17.4.4.4 P-Flash Commands MC9S12VR
Page 487 and 488: 17.4.6 Flash Command Description MC
Page 489 and 490: Table 17-35. Erase Verify P-Flash S
Page 491 and 492: 17.4.6.6 Program Once Command Table
Page 493 and 494: Table 17-44. Erase Flash Block Comm
Page 497 and 498: 17.4.6.13 Set Field Margin Level Co
Page 499 and 500: Table 17-59. Erase Verify EEPROM Se
Page 501 and 502: 17.4.7 Interrupts MC9S12VR Family R
Page 505 and 506: Appendix A MCU Electrical Specifica
Page 507 and 508: A.1.3 Current Injection MC9S12VR Fa
Page 509 and 510: A.1.5 ESD Protection and Latch-up I
Page 511 and 512: A.1.6 Operating Conditions MC9S12VR
Page 513 and 514: VBAT GND Figure A-2. Supply Current
Page 515 and 516: A.1.8 I/O Characteristics This sect
Page 517 and 518: Table A-10. CPMU Configuration for
Page 519 and 520: Appendix B VREG Electrical Specific
Page 521 and 522: Appendix C ATD Electrical Specifica
Page 523 and 524: Supply voltage 3.13 V < V DDA < 5.5
Page 525: Supply voltage V DDA =5.12 V, -40 o
Page 529 and 530: Appendix E PLL Electrical Specifica
Page 533 and 534: Appendix F IRC Electrical Specifica
Page 535 and 536: Appendix G LINPHY Electrical Specif
Page 539 and 540: Appendix H LSDRV Electrical Specifi
Page 541 and 542: Appendix I BATS Electrical Specific
Page 543 and 544: 9 D VSENSE Series Resistor Required
Page 545 and 546: Appendix J PIM Electrical Specifica
Page 547 and 548: Appendix K SPI Electrical Specifica
Page 549 and 550: f SCK /f bus 1/2 1/4 5 Figure K-3.
Page 551 and 552: In Table K-3. the timing characteri
Page 553 and 554: Appendix L XOSCLCP Electrical Speci
Page 555 and 556: Appendix M FTMRG Electrical Specifi
Page 557 and 558: M.1.1 NVM Reliability Parameters Ta
Page 559 and 560: Appendix N Package Information MC9S
Page 565 and 566: Appendix O Ordering Information MC9
Page 567 and 568: Appendix P Detailed Register Addres
Page 569 and 570: 0x001A-0x001B Part ID Registers MC9
Page 571 and 572: 0x0034-0x003F Clock Reset and Power
Page 573 and 574: 0x0070-0x009F Analog to Digital Con
Page 575 and 576: 0x00A0-0x00C7 Pulse Width Modulator
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0x0120 Interrupt Vector Base Regist
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0x0160-0x0167 LIN Physical Layer (L
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0x0240 -0x027F Port Integration Mod
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0x0280-0x02EF Reserved MC9S12VR Fam
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