B2 - Schoonover, Inc.

Thin Film Metrology Sensor System
LES1200
System Components
♦ PC computer (minimum Pentium or equivalent processor)
♦ PCI multi-sensor control board for up to four sensor heads
♦ Software for data acquisition, control and analysis
♦ Remote, pixel-memory-mapped CCD head(s)
♦ Control daughter board(s)
♦ Imaging optics
Options
♦ External light source
♦ TR1200 Trench Metrology Sensor head
♦ Tool communication interface and software
Installation Requirements
♦ Optical access to the wafer via a viewpoint at an angle of less than 60¡
from wafer normal (larger angles can usually be accommodated)
♦ Clear view of the region of interest on the wafer during processing
Sensor Platform System
Sensor Platform:
♦ FabGuard software
♦ PCI sensor control board
Add Ð one or more Thin Film or Trench Metrology sensor heads
Add Ð one computer control system
Add Ð communications package (optional)
two days installation and training
one year technical support and updates
(software and documentation)
LES1200 Thin Film Metrology
Sensor Head
♦ Software for data acquisition, control and analysis
♦ Remote, pixel-memory mapped CCD head
♦ Control daughter board
♦ Bi-directional digital cable
♦ Single focal length lens 2
♦ Two narrow bandpass filters 2
♦ Mount for sensor head
OR
TR1200 Trench Metrology Sensor Head 1
♦ Software for data acquisition, control and analysis
♦ Laser head
♦ Beam expansion and re-focusing optics
♦ Laser-line bandpass filter
♦ Neutral density filter
♦ Remote, pixel-memory mapped CCD head
♦ Control daughter board
♦ Bi-directional digital cable
♦ Mount for sensor head
1 632.8mn HeNe or 543.5nm HeNe laser standard; other lasers optional.
2 Focal length/wavelength options; application dependent.
B3.4