B2 - Schoonover, Inc.

LES1200
Thin Film Metrology Sensor System
Ordering Information SPSC -____ ____ ____ ____ ____ ____ ____
Sensor platform
1st sensor head:
None
LES1200 Thin Film Metrology Sensor Head
TR1200 Trench Metrology Sensor Head
2nd sensor head:
None
LES1200 Thin Film Metrology Sensor Head
TR1200 Trench Metrology Sensor Head
3rd sensor head:
None
LES1200 Thin Film Metrology Sensor Head
TR1200 Trench Metrology Sensor Head
4th sensor head:
None
LES1200 Thin Film Metrology Sensor Head
TR1200 Trench Metrology Sensor Head
Computer option:
None (set-up fee for customer supplied computers)
COMP-D desktop computer
Standard configuration for system with one sensor 1
300 Mhz Pentium II with 128MB RAM; PCI and ISA bus;
SCSI fast controller, PCI bus; 4GB fast SCSI hard disk;
SCSI CD-ROM; 4-8GB DAT SCSI tape drive & backup
software; video card 1280x1024x256, 4MB memory,
PCI bus; 17" monitor; trackball or mouse;
Windows NT 4.0 workstation; screen capture software
COMP-I industrial computer
Typical configuration is similar to Desktop with
the following additions: heavy duty, rack-mount
industrial chassis; backplane with 6 ISA, 6 PCI,
1 CPU slots; 300w power supply.
Communications package:
None
Special
Maximum rate
Minimum rate
Accuracy
Maximum film thickness (typical)
Minimum film thickness
Technical Data
Maximum data acquisition rate
Minimum open area (applies to etching only)
CCD spectral range
Cable length
Sensor space requirement
Sensor weight
1
0
1
2
0
1
2
0
1
2
0
1
2
0
1
2
0
1 1 Additional RAM and/or additional CPU(s) may be required for a system with more than one
sensor; larger hard drives may also be recommended.
LES1200
polysilicon 130,000 /min
oxide 300,000 /min
20 /min
1% - 2%
polysilicon 15,000
oxide 50,000
polysilicon 700
oxide 1200
25 Hz
5%
400 -1100 nm (down to 220 nm with UV modifications)
10M standard
approximately 70 mm x 100 mm x 70 mm (including mounting bracket)