Electronic Material Properties - und Geowissenschaften ...
Electronic Material Properties - und Geowissenschaften ...
Electronic Material Properties - und Geowissenschaften ...
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• Surface analysis<br />
The UHV-surface science equipment and techniques using different and versatile<br />
integrated preparation chambers is used for cooperative service investigations.<br />
For the experiments we use integrated UHV-preparation and analysis-systems (UPS,<br />
(M)XPS, LEISS, LEED), spectromicroscopy (PEEM) coupled with UHV-STM/AFM. We<br />
further apply synchrotron radiation (SXPS, spectromicroscopy), scanning probe methods<br />
(STM, AFM), and electrochemical measuring techniques. UHV-preparation chambers<br />
dedicated for MBE, CVD, PVD and (electro)chemical treatment are available.<br />
The member of the group are involved in basic courses of the department’s curriculum and<br />
offer special courses on the physics, chemistry and engineering of semiconductor devices<br />
and solar cells, on surface and interface science, and on thin film and surface technology.<br />
Staff Members<br />
Head<br />
Prof. Dr. W. Jaegermann<br />
Research Associates Dr. David Ensling<br />
Dr. Ralf Hunger<br />
Dr. Alexander Issanin<br />
Technical Personnel<br />
Secretary<br />
PhD Students<br />
Diploma Students<br />
Dipl.-Ing. Erich Golusda<br />
Dipl.-Ing. Gabi Haindl<br />
Marga Lang<br />
Dipl.-Ing. Yvonne Gassenbauer<br />
Dipl.-Ing. Christoph Körber<br />
Dipl.-Ing. Johannes Luschitz<br />
Dipl.-Ing. Erik Mankel<br />
Dipl.-Ing. Frank Säuberlich<br />
Mario Böhme<br />
Maxime Monnoyer<br />
Bastian Siepchen<br />
Guest Scientist Alireza Barati<br />
Dr. Sivakumar Bhuvaneswari<br />
Dr. Massimiliano Liberatore<br />
Dr. Venkata Rao Gutlapalli<br />
Krishnakumar Velappan<br />
- 24 -<br />
Dr. Andreas Klein<br />
Dr. Thomas Mayer<br />
Dr. Andreas Thißen<br />
Kerstin Lakus-Wollny<br />
Christina Spanheimer<br />
Dipl.-Ing. Bastian Siepchen<br />
Dipl.-Ing. Robert Schafranek<br />
Dipl.-Ing. Konrad Schwanitz<br />
Dipl.-Ing. Bettina Späth<br />
Dipl.-Ing. Ulrich Weiler<br />
Mark Trummlitz<br />
André Wachau