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Electronic Material Properties - und Geowissenschaften ...

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transition allows to investigate at constant loading ∆K, the change in crack closure due to<br />

microstructural change.<br />

The results of crack closure measurements are expressed by the development of Kop over<br />

the crack distance from the transition (Fig. 2). It is obvious that the slope of the linear<br />

approximation is different for the two crack propagation directions (equiaxed to lamellar<br />

and lamellar to equiaxed). The difference in the slope for the two crack propagation<br />

directions indicates that there is a “microstructual history effect”, which affects crack<br />

closure and therefore crack growth rate too, leading to direction depending crack<br />

propagation rates.<br />

K op [MPam 1/2 ]<br />

8<br />

7<br />

6<br />

5<br />

4<br />

3<br />

2<br />

m=-0,29<br />

m=0,46<br />

equiaxed to lamellar<br />

lamellar to equiaxed<br />

-6 -4 -2 0 2 4 6 8 10 12<br />

distance from transition [mm]<br />

Fig. 2: Variation of Kop with the change in microstructure<br />

Derived from dislocation theory, equation 1 is valid to calculate Kop in the case of<br />

roughness induced crack closure.<br />

2<br />

1/<br />

2 3/<br />

2 Sθ<br />

K op = C ⋅σ<br />

ys ⋅ K max ⋅ SH<br />

⋅ sin Sθ<br />

⋅ cos<br />

(eq. 1)<br />

2<br />

SH, Sθ: standard deviation of height- and angle-distribution C: fitting parameter<br />

Calculation of Kop is in good agreement with experimental values in lamellar<br />

microstructures showing roughness induced crack closure. In the range of microstructural<br />

transition the calculated Kop values do not fit the experimental ones. This indicates that<br />

small volume fractions of equiaxed grains reduce the roughness induced crack closure<br />

significantly by reducing the shear displacement of the crack tip.<br />

- 64 -

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