Logic selection guide 2016

The leadless advantage
Today’s ultra-compact designs can be a challenge when it
comes to squeezing more functionality into a smaller space.
Tiny leadless packages can deliver a significant advantage
here – with options like DQFN, MicroPak, and Diamond
packages offering a smaller footprint with improved
mechanical performance.
Leadless packages use pads instead of leads. The pads
present a bigger solderable area, so they create a stronger
bond with the PCB. The result is a design that is more
compact, and also more durable. NXP’s DQFN, MicroPak, and
Diamond packages perform better in mechanical tests like
pull, shear, drop, and bend.
The NXP portfolio includes more than 50 leadless
packages, and all are qualified for use in automotive-grade
environments. Our LVC, AUP, and AXP logic functions are
available in leadless DQFN, MicroPak, and Diamond packages,
so it’s easy to find the right mix of features, footprint, and
cost.
When transitioning to leadless formats, consider the following
guidelines:
4 For gates, octals, and other logic functions with 10 or more
pins, choose the DQFN package. It uses the same die as a
TSSOP, but the footprint is up to 76 percent smaller.
4 For single-, dual-, and triple-gate functions, which typically
use fewer than 10 pins, choose the MicroPak package. It
uses the same die as a PicoGate, but the footprint is up to
62 percent smaller.
Recommended replacements for leaded packages
Leaded
package
Leadless
equivalent
Space savings
Best for
functions of
TSSOP DQFN Up to 76% smaller 10+ pins
PicoGate
MicroPak Up to 62% smaller 6 to 10 pins
Diamond
Environmental compliance
25% smaller than smallest
MicroPak (XSON6)
5 pins
Respect for the environment is one of the guiding principles
of the NXP Sustainability Policy. Our ongoing commitment to
excellence in this area means we continuously move toward
best-in-class environmental standards, and supply products
that use fewer hazardous or restricted substances and can be
recycled or disposed of in an environmentally sound way.
Our products comply with the following:
4 European Union Restriction on Hazardous Substances
(RoHS) directive
4 End of Life Vehicle (ELV) directive
4 China RoHS
NXP was one of the earliest semiconductor companies to
address environmental concerns over packaging, and we
have worked quickly to reduce or eliminate the presence of
lead, mercury, chromium, and poly-brominated compounds.
We follow the guidelines for compliance with environmental
directives, such as RoHS, and go beyond the baseline
requirements by reducing the limits of antimony oxides
(Sb 2
O 3
, Sb 2
O 5
), as well as chlorinated and brominated flame
retardants. Our “Dark Green” packages are RoHS compliant
and also free of halogen and antimony.
Our Dark Green products have less impact on the environment
and, as an added bonus, are more resistant to moisture. Dark
Green packages don’t require dry-pack processing, which
involves drying the package and sealing it in plastic, and this
delivers an added saving on energy and resources. The latest
Dark Green products also use smaller ICs, so they can be
housed in smaller packages. The result is lower cost, fewer
materials, lower power consumption and, of course, a reduced
environmental footprint.
Definitions of Green and Dark Green
Green = RoHS compliant
Substance(s)
Pb
Hg, Cr6+, PBB, PBDE
Cd
Limit
< 1000 ppm
< 1000 ppm
< 100 ppm
Dark Green = RoHS compliant and free of antimony and halogen
Substances
Antimony oxides (Sb 2
O 3
, Sb 2
O 5
)
Chlorinated and brominated flame
retardants
Limit
< 900 ppm
∑ < 900 ppm
Note: substances above are not intentionally added, but might be present as an
impurity with an upper limit according to the listed values. The plastic materials
are classified according to UL94V-0.
Online access to all chemical contents
We were the very first to list all the chemical contents in our
products on an easy-to-access web page that also shows
compliance with legislative requirements (www.nxp.com/
chemical-content/search/). Search results can be downloaded
to an Excel or Zip file.
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