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Logic selection guide 2016

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SOT650-1<br />

TK<br />

SOT753-1<br />

GV<br />

Pinout<br />

Pinout<br />

10 6<br />

5<br />

4<br />

1 2 3<br />

1 5<br />

Package dimensions<br />

Transparent top view<br />

Package dimensions<br />

3.1<br />

2.9<br />

3.1<br />

2.7<br />

1.1<br />

0.9<br />

0.5<br />

1<br />

2.0<br />

5<br />

0.30<br />

0.18<br />

1.0<br />

0.05<br />

0.00<br />

5<br />

4<br />

0.6<br />

0.2<br />

0.55<br />

0.30 3.1<br />

2.9<br />

10<br />

2.55<br />

2.15<br />

Dimensions in mm<br />

6<br />

1.75<br />

1.45<br />

14-10-01<br />

3.0<br />

2.5<br />

1.7<br />

1.3<br />

1 2 3<br />

0.40<br />

0.95<br />

0.25<br />

1.9<br />

Dimensions in mm<br />

0.26<br />

0.10<br />

14-10-03<br />

Footprint information for reflow soldering of HVSON10 package<br />

Solder footprint<br />

SOT650-1<br />

Solder footprint<br />

Gx<br />

D P<br />

(0.105)<br />

C<br />

nSPx<br />

SPx<br />

SPy<br />

Hy<br />

Gy<br />

SPy tot<br />

nSPy<br />

SLy<br />

By<br />

Ay<br />

SPx tot<br />

SLx<br />

Generic footprint pattern<br />

Refer to the package outline drawing for actual layout<br />

solder land<br />

solder paste deposit<br />

solder land plus solder paste<br />

occupied area<br />

DIMENSIONS in mm<br />

P Ay By C D SLx SLy SPx tot SPy tot SPx SPy Gx Gy Hy<br />

nSPx nSPy<br />

4.000 2.200<br />

0.500 0.240<br />

0.900 2.400 1.500 1.400 0.650 0.550 0.650 3.300 3.300 4.250 2 1<br />

Issue date<br />

09-12-29<br />

09-12-29<br />

sot650-1_fr<br />

136 NXP <strong>Logic</strong> <strong>selection</strong> <strong>guide</strong> <strong>2016</strong>

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