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Logic selection guide 2016

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SOT765-1<br />

DC<br />

SOT833-1<br />

GT<br />

Pinout<br />

Pinout<br />

8<br />

5<br />

8<br />

7<br />

6<br />

5<br />

1<br />

4<br />

1 2 3 4<br />

Transparent top view<br />

Package dimensions<br />

Package dimensions<br />

2.1<br />

1.9<br />

8 5<br />

1.0<br />

max<br />

0.15<br />

0.00<br />

1<br />

2<br />

2.0<br />

1.9<br />

3<br />

4<br />

0.25<br />

0.17<br />

0.5<br />

0.04<br />

3.2<br />

3.0<br />

2.4<br />

2.2<br />

0.40<br />

0.15<br />

1.05<br />

0.95<br />

0.6<br />

0.40<br />

0.32<br />

0.35<br />

0.27<br />

1 4<br />

0.27<br />

Footprint information for reflow soldering 0.5 of VSSOP8 package<br />

0.17<br />

Dimensions in mm<br />

0.23<br />

0.08<br />

14-10-01<br />

8<br />

SOT765-1<br />

Dimensions in mm<br />

7 6<br />

0.5 0.5 0.5<br />

5<br />

14-09-30<br />

Solder footprint<br />

Solder footprint<br />

Hx<br />

Gx<br />

P2<br />

D1<br />

(0.125)<br />

Hy<br />

Gy<br />

By<br />

Ay<br />

C<br />

(0.175)<br />

(0.125)<br />

D2 (4x)<br />

P1<br />

Generic footprint pattern<br />

Refer to the package outline drawing for actual layout<br />

solder land<br />

occupied area<br />

DIMENSIONS in mm<br />

P1<br />

P2<br />

Ay By C D1 D2 Gx Gy Hx Hy<br />

0.500<br />

0.550<br />

3.500 2.000 0.750 0.300<br />

0.400 2.250 1.750<br />

3.075<br />

3.750<br />

sot765-1_fr<br />

NXP <strong>Logic</strong> <strong>selection</strong> <strong>guide</strong> <strong>2016</strong><br />

137

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