TO 1-1-700 - Robins Air Force Base
TO 1-1-700 - Robins Air Force Base
TO 1-1-700 - Robins Air Force Base
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<strong>TO</strong> 1-1-<strong>700</strong><br />
TT-I-735, ALCOHOL, ISOPROPYL 65<br />
a. Apply a mixture of one part TT-I-735, Isopropyl Alcohol,<br />
and one part distilled water to affected areas with a<br />
CCC-C-46 Cleaning Cloth, acid brush, toothbrush or<br />
other brush as appropriate.<br />
b. Wipe or scrub affected area until contaminants have<br />
been removed.<br />
c. Remove residue by blotting or wiping with a CCC-C-46<br />
Cleaning Cloth. Inspect affected areas for signs of residues<br />
and contaminants.<br />
d. Repeat steps a through c until all contaminants are<br />
removed.<br />
e. Discard contaminated cloths and solvents in approved<br />
disposal containers after cleaning operation to avoid<br />
contamination of other components.<br />
MIL-PRF-85570, CLEANING COMPOUND, AIRCRAFT 51<br />
a. Wipe surface with a CCC-C-46, Class 7 Cleaning Cloth,<br />
acid brush, disposable applicator, or pipe cleaner dampened<br />
with MIL-PRF-87937, Type IV, or MIL-PRF-<br />
85570, Type II, Cleaning Compound, until clean.<br />
b. Dry surface with a CCC-C-46, Class 7 Cleaning Cloth,<br />
disposable applicator, or pipe cleaner.<br />
8.6.3.9 Removal of Bacteria and Fungi. Bacterial, mold,<br />
and fungal growth is facilitated by the presence of surface<br />
contaminants (such as dust, fingerprints, and corrosion product)<br />
and water. The best way to prevent or minimize the presence<br />
of these organisms is to maintain cleanliness and prevent<br />
moisture intrusion or high humidity. Fungus, mold, and bacteria<br />
shall be cleaned using the following procedure:<br />
a. Mask capacitors, relay contacts, switches, and tunable<br />
coils with SAE-AMS-T-21595, Type I, Pressure-Sensitive<br />
Tape.<br />
TT-I-735, ALCOHOL, ISOPROPYL 65<br />
TT-I-735, ALCOHOL, ISOPROPYL 65<br />
Ensure that EPROM devices are protected from UV<br />
light and that ESD sensitive components are adequately<br />
protected.<br />
8.6.3.7 Removal of Solder Flux Residue. Solder flux is<br />
used on all solder operations and it leaves behind a corrosive<br />
residue. Corrosion will occur if the flux residue is exposed to<br />
an electrolyte. Cleaning solder flux residue requires the use of<br />
solvents that do not damage the surrounding components. The<br />
presence of solder flux can be detected using ultraviolet light.<br />
Under UV light, solder flux residue appears as a fluorescent<br />
stain. Solder flux residue shall be removed with a solution of<br />
three parts TT-I-735, Isopropyl Alcohol, to one part distilled<br />
water.<br />
8.6.3.8 Removal of Silicone Lubricant. Silicone residue<br />
can be removed from surfaces using the following procedures:<br />
MIL-PRF-87937, CLEANING COMPOUND, AIRCRAFT 52<br />
b. Apply a mixture of one part TT-I-735, Isopropyl Alcohol,<br />
and one part distilled water to affected areas with a<br />
CCC-C-46, Class 7 Cleaning Cloth, acid brush, toothbrush<br />
or other brush as appropriate.<br />
c. Wipe or scrub affected area until contaminants have<br />
been removed.<br />
d. Remove residue by blotting or wiping with a CCC-C-<br />
46, Class 7 Cleaning Cloth. Inspect affected areas for<br />
signs of residues and contaminants.<br />
e. Repeat steps a through c until all contaminants are<br />
removed.<br />
f. Discard contaminated cloths and solvents in approved<br />
disposal containers after cleaning operation to avoid<br />
contamination of other components.<br />
8.6.3.10 Removal of Dust, Dirt, Grease, and Oil. Dust,<br />
dirt, grease, and oil can trap contaminants or moisture that<br />
facilitates the corrosion process. In addition, they can provide<br />
food for microorganisms that attack electronics. Dust, grease,<br />
dirt, and oil shall be removed using the following procedure:<br />
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