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TO 1-1-700 - Robins Air Force Base

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<strong>TO</strong> 1-1-<strong>700</strong><br />

TT-I-735, ALCOHOL, ISOPROPYL 65<br />

a. Apply a mixture of one part TT-I-735, Isopropyl Alcohol,<br />

and one part distilled water to affected areas with a<br />

CCC-C-46 Cleaning Cloth, acid brush, toothbrush or<br />

other brush as appropriate.<br />

b. Wipe or scrub affected area until contaminants have<br />

been removed.<br />

c. Remove residue by blotting or wiping with a CCC-C-46<br />

Cleaning Cloth. Inspect affected areas for signs of residues<br />

and contaminants.<br />

d. Repeat steps a through c until all contaminants are<br />

removed.<br />

e. Discard contaminated cloths and solvents in approved<br />

disposal containers after cleaning operation to avoid<br />

contamination of other components.<br />

MIL-PRF-85570, CLEANING COMPOUND, AIRCRAFT 51<br />

a. Wipe surface with a CCC-C-46, Class 7 Cleaning Cloth,<br />

acid brush, disposable applicator, or pipe cleaner dampened<br />

with MIL-PRF-87937, Type IV, or MIL-PRF-<br />

85570, Type II, Cleaning Compound, until clean.<br />

b. Dry surface with a CCC-C-46, Class 7 Cleaning Cloth,<br />

disposable applicator, or pipe cleaner.<br />

8.6.3.9 Removal of Bacteria and Fungi. Bacterial, mold,<br />

and fungal growth is facilitated by the presence of surface<br />

contaminants (such as dust, fingerprints, and corrosion product)<br />

and water. The best way to prevent or minimize the presence<br />

of these organisms is to maintain cleanliness and prevent<br />

moisture intrusion or high humidity. Fungus, mold, and bacteria<br />

shall be cleaned using the following procedure:<br />

a. Mask capacitors, relay contacts, switches, and tunable<br />

coils with SAE-AMS-T-21595, Type I, Pressure-Sensitive<br />

Tape.<br />

TT-I-735, ALCOHOL, ISOPROPYL 65<br />

TT-I-735, ALCOHOL, ISOPROPYL 65<br />

Ensure that EPROM devices are protected from UV<br />

light and that ESD sensitive components are adequately<br />

protected.<br />

8.6.3.7 Removal of Solder Flux Residue. Solder flux is<br />

used on all solder operations and it leaves behind a corrosive<br />

residue. Corrosion will occur if the flux residue is exposed to<br />

an electrolyte. Cleaning solder flux residue requires the use of<br />

solvents that do not damage the surrounding components. The<br />

presence of solder flux can be detected using ultraviolet light.<br />

Under UV light, solder flux residue appears as a fluorescent<br />

stain. Solder flux residue shall be removed with a solution of<br />

three parts TT-I-735, Isopropyl Alcohol, to one part distilled<br />

water.<br />

8.6.3.8 Removal of Silicone Lubricant. Silicone residue<br />

can be removed from surfaces using the following procedures:<br />

MIL-PRF-87937, CLEANING COMPOUND, AIRCRAFT 52<br />

b. Apply a mixture of one part TT-I-735, Isopropyl Alcohol,<br />

and one part distilled water to affected areas with a<br />

CCC-C-46, Class 7 Cleaning Cloth, acid brush, toothbrush<br />

or other brush as appropriate.<br />

c. Wipe or scrub affected area until contaminants have<br />

been removed.<br />

d. Remove residue by blotting or wiping with a CCC-C-<br />

46, Class 7 Cleaning Cloth. Inspect affected areas for<br />

signs of residues and contaminants.<br />

e. Repeat steps a through c until all contaminants are<br />

removed.<br />

f. Discard contaminated cloths and solvents in approved<br />

disposal containers after cleaning operation to avoid<br />

contamination of other components.<br />

8.6.3.10 Removal of Dust, Dirt, Grease, and Oil. Dust,<br />

dirt, grease, and oil can trap contaminants or moisture that<br />

facilitates the corrosion process. In addition, they can provide<br />

food for microorganisms that attack electronics. Dust, grease,<br />

dirt, and oil shall be removed using the following procedure:<br />

8-29

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