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TO 1-1-700 - Robins Air Force Base

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<strong>TO</strong> 1-1-<strong>700</strong><br />

TT-I-735, ALCOHOL, ISOPROPYL 65<br />

MIL-PRF-81309, LUBRICANT, CORROSION PREVEN-<br />

TIVE COMPOUND 46<br />

3.12.4 EMI Seals and Gaskets, Corrosion Effects.<br />

Examples of typical EMI shielding and gasket materials can<br />

be found in Chapter 7 of <strong>TO</strong> 1-1-691. Figure 7-1 shows an<br />

elastomeric seal and gasket with an embedded or attached conductor,<br />

Figure 7-2 shows a conductive elastomer gasket, Figure<br />

7-3 shows metallic screens installed under composite<br />

cover, Figure 7-4 shows bonding cables on an access door, and<br />

Figure 7-5 shows bonding washers for an electronics equipment<br />

bay enclosure. When corrosion is observed in such areas,<br />

disassemble only the affected areas and remove the corrosion<br />

using the mildest available method necessary to remove the<br />

corrosion. Carefully clean the area with a lint free cloth wet<br />

with TT-I-735 Isopropyl Alcohol. Dry with a clean cloth. If<br />

replacement seals are available, install them in accordance<br />

with the appropriate equipment system specific maintenance<br />

manual. If replacement seals are not available or do not exist,<br />

spray the contacting surfaces with a light coating of MIL-PRF-<br />

81309, Type III avionics grade, water displacing CPC, and<br />

then reassemble. Periodically inspect repaired areas and areas<br />

known to be chronic problems. Consult Chapter 8 of this manual<br />

for additional information on effects and treatment of corrosion<br />

at EMI shielding and gasket locations.<br />

3.12.5 Electrostatic Discharge Sensitivity (ESDS). ESD<br />

is the transfer of electrostatic charge between bodies with different<br />

electrostatic potentials caused either by direct contact or<br />

induced by an electrostatic field. The most formidable ESD is<br />

lightening or electromagnetic pulse (EMP). Discharges from<br />

human bodies are the most frequent, least noticeable, and most<br />

ignored ESD. ESD affects electronic devices in a number of<br />

different ways. It can degrade performance, change the electrical<br />

characteristics, or cause complete failure. Very Large Scale<br />

Integration Devices (VLSI) digital components are rapidly<br />

increasing in functional power, speed, and system applications<br />

in military C-E-M equipment. Making VLSI devices small<br />

results in less voltage required for circuit operation, but this<br />

decreases the noise immunity, and many are highly susceptible<br />

to damage from ESD. ESD affects many components such as<br />

transistors, resisters, Integrated Circuits (IC), and other types<br />

of semiconductor devices. A spark discharge resulting from an<br />

accumulation of electrostatic charges may not immediately<br />

destroy a device or cause it to become nonfunctional; it can be<br />

permanently damaged and yet perform its intended function.<br />

Additional exposure to spark discharges and/or continued use<br />

of the device can further damage the device until failure<br />

finally occurs. Known as latent failure, this results in a serious<br />

system reliability problem. It is essential that all personnel<br />

involved with repair, handling, transporting, and storing of<br />

ESDS items be concerned about ESD. Package, ship, and store<br />

all ESDS items in ESD protective materials. Consult <strong>TO</strong> 00-<br />

25-234 and <strong>TO</strong> 1-1-689-series for additional information on<br />

the <strong>Air</strong> <strong>Force</strong> ESD program.<br />

3.12.6 ESD Protective Systems, Corrosion Effects. Corrosion<br />

degrades electrical and mechanical properties of ESD<br />

protective systems and can significantly increase the susceptibility<br />

of ESDS equipment/components. Exposure to various<br />

field service environmental conditions in normal usage, sometimes<br />

in only 3 to 4 months, can cause galvanic corrosion<br />

problems to start. Corrosion between metal surfaces of C-E M<br />

equipment generates a two-fold problem: 1) structural weaknesses<br />

that open gaps in the exterior case of the equipment<br />

thus undermining the shield to internal ESDS components;<br />

and 2) damage and/or elimination of the conductive path that<br />

allows static electricity to be bled away from the equipment<br />

before it can begin sparking due to static discharge. Without<br />

regular maintenance and cleaning, the buildup of absorbed<br />

atmospheric pollutants, dust, and field debris can contribute to<br />

degradation of ESD shielding by promoting corrosion and acting<br />

as insulators themselves. Follow the instructions for protective<br />

measures required for ESDS equipment in Chapter 8 of<br />

this manual as well as procedures for maintaining proper<br />

bonding/grounding connections and protective EMI shields<br />

and gaskets in Chapters 8 of this manual respectively.<br />

3-21/(3-22 blank)

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