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Nondestructive testing of defects in adhesive joints

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temperatures exhibited by the 50 nm thick film is similar to the behaviour observed earlier for pure<br />

P4VP [8] <strong>in</strong>dicat<strong>in</strong>g that the film consists <strong>of</strong> small particles separated by small distances. With<br />

further <strong>in</strong>crease <strong>in</strong> P4VP content, the negative TCR part dim<strong>in</strong>ishes, giv<strong>in</strong>g rise to a near zero TCR.<br />

It is also <strong>in</strong>terest<strong>in</strong>g to note that even at 50% P4VP, with an <strong>in</strong>crease <strong>of</strong> silver deposited, films show<br />

electrical characteristics as that <strong>of</strong> the films on pure P4VP [8]. Further, when 150 nm thick silver is<br />

deposited on a polymer blend with only 25% <strong>of</strong> P4VP, the films show desirable electrical<br />

characteristics <strong>in</strong> contrast with the very high room temperature resistance observed for films on pure<br />

PS even at 300 nm <strong>of</strong> silver [7].This <strong>in</strong>dicates blend<strong>in</strong>g has positive effect on electrical properties on<br />

silver films deposited on PS. It was shown through X-ray photoelectron spectroscopy (XPS) studies at<br />

various electron take <strong>of</strong>f angles (ETOA) that silver clusters are formed at a depth <strong>of</strong> a couple <strong>of</strong> nm<br />

from the polymer surface [7,8]. It is known that the formation <strong>of</strong> subsurface particulate structure is<br />

subject to certa<strong>in</strong> thermodynamic [4] and deposition conditions [3]. While the thermodynamic<br />

conditions are met for the deposition <strong>of</strong> metals on most <strong>of</strong> the polymer substrates, deposition<br />

conditions used <strong>in</strong> the present study are similar to those used <strong>in</strong> our earlier studies. Therefore, it is<br />

reasonable to assume that the particles are formed just a couple <strong>of</strong> nm below the polymer surface.<br />

Table 1 gives the resistance data and particle size estimated from the X-ray l<strong>in</strong>e width measurements<br />

for the silver films <strong>of</strong> different thicknesses deposited on the PS/P4VP blends <strong>of</strong> various compositions.<br />

It is seen that the resistance <strong>of</strong> silver films at room temperature lie at a few tens <strong>of</strong> MΩ/ , at certa<strong>in</strong><br />

thicknesses even for the PS content <strong>of</strong> 50-75%, <strong>in</strong> contrast with the behaviour <strong>of</strong> silver on pure PS.<br />

The particle size <strong>in</strong>creases with <strong>in</strong>crease <strong>in</strong> PS content at a fixed silver thickness, as expected. It is<br />

seen that as the P4VP concentration <strong>in</strong>creases there is a regular decrease <strong>of</strong> resistance at a fixed silver<br />

thickness. The plot <strong>of</strong> logarithm <strong>of</strong> these resistances with blend concentration gives l<strong>in</strong>ear fit as shown<br />

<strong>in</strong> figure 2. Through this fit, one can estimate the resistance <strong>of</strong> the film at a particular blend and for<br />

the given conditions and thickness.<br />

Conclusions:<br />

1. Deposition <strong>of</strong> silver on polymer blends coated substrate held at 457 K provides an approach to<br />

produce stable island films with reasonable control over their electrical resistance.<br />

2. Higher thickness films show almost zero TCR near room temperature, a desirable property for most<br />

<strong>of</strong> the devices. Low thickness films show a negative TCR, characteristic <strong>of</strong> island films.<br />

3. Silver particulate films deposited on PS/P4VP blends show better electrical properties compared to<br />

those on pure PS, even at a P4VP content <strong>of</strong> 25%. The blends PS/ P4VP (50:50, 25:75) seem to be<br />

better with regard to their electrical behaviour.

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