Nondestructive testing of defects in adhesive joints

Acknowledgment:
One of the authors (PP) thanks Department of Science and Technology, Government of India, for
financial assistance.
References
[1] Kovacs G J and Vincentt P S 1982 J. Colloid. Interface. Sci. 90 335
[2] Kovacs G J and Vincentt P S 1983 Thin Solid Films 100 341
[3] Kovacs G J, Vincentt P S, Trumblay C and Pundsak A L 1983 Thin Solid
Films 101 21
[4] Kovacs G J and Vincentt P S 1984 Thin Solid Films 111 65
[5] Kunz M S, Shull K R and Kellock A J 1992 J. Appl. Phys. 72 4458
[6] Mohan Rao K and Pattabi M 2001 J. New Mat. Electrochem. Systems 4 11
[7] Mohan Rao K, Pattabi M, Mayya K S, Sainkar S R and Murali Sastry M S
1997 Thin Solid Films 310 97
[8] Mohan Rao K, Manjunatha Pattabi, Sainkar S R, Arun Lobo, Kulkarni S K,
Jayasheela Uchil and Murali Sastry M S 1999 J. Phys. D: Appl.Phys. 32 2327
Table 1: Resistances at substrate temperature (Rst), after one hour of aging ( R1hr), at Room
temperature (Rrt) and particle size for silver films deposited on PS/P4VP blends held at 457 K.
Polymer
PS:P4VP
Silver film
thickness
Resistances (MΩ/ ) Particle size
XRD (nm)
Rst R1 hra Rrt
0:100 50 nm 1.9 26.8 27.1 30
25:75 50 nm 6.2 42.2 47.1 46.6
25:75 85 nm 3.2 14.7 14.2 53
50:50 50 nm 15.9 119.5 159.4 49.1
50:50 95 nm 2.9 29.9 30.1 47.5
75:25 50 nm 214 325 - 51.8
75:25 150 nm 14.8 98.2 248.9 46.4
100:0 50 nm 302 491 - 53.3