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Metal Foams: A Design Guide

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Case studies 227<br />

required for compactness. Each IGBT in commercial systems is configured<br />

as shown in Figure 17.11. Each module comprises several IGBTs with an<br />

equal number of diodes (six would be typical for a 75 hp motor drive). In<br />

steady operation, the heat, q, generated at the electronics in each IGBT may<br />

be as large as 6 MW/m 2 . The flux is in one direction and is transferred to<br />

the coolant by a heat sink comprising a fin-pin array subject to flowing air<br />

generated by a fan. Conventional air-cooled heat sinks operate at fluxes, q �<br />

2kW/m 2 (Figure 17.12). The ratio q/q is accommodated by designing the<br />

sink with a cross-sectional dimension, bhs, that relates to that for the Si, bsi,<br />

Plastic<br />

housing<br />

Gel Wirebonded<br />

encapsule interconnections<br />

Silicon<br />

Soldered interconnections<br />

Ceramic insulation<br />

2b hs = 50 cm<br />

Power terminals<br />

Figure 17.11 Conventional power electronic packaging<br />

Temperature Difference (°C)<br />

10 3<br />

10 2<br />

10<br />

10 −4<br />

1<br />

Direct Air, natural convection + radiation<br />

Direct air, forced convection<br />

10 −3<br />

Immersion-Boiling<br />

fluorocarbons<br />

Immersion, natural convection fluorocarbons<br />

Water, forced convection<br />

10 −2<br />

Surface heat flux (MW/m 2 )<br />

10 −1<br />

Figure 17.12 Performance domains for heat sinks<br />

Aircooled<br />

mesocell<br />

heat<br />

sink<br />

<strong>Metal</strong> baseplate

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