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Metal Foams: A Design Guide

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232 <strong>Metal</strong> <strong>Foams</strong>: A <strong>Design</strong> <strong>Guide</strong><br />

heat flux, back pressure and fluid flow rate. Some results for a representative<br />

density ( / s D 0.3) are plotted in Figure 17.16. The benefits of the cellular<br />

metal can only be utilized if the fan/blower assembly is capable of operating at<br />

back pressures of order 0.1 atm (10 kPa), while delivering flow rates about one<br />

l/s. Upon comparison with Figure 17.12, it is apparent that these heat fluxes<br />

substantially exceed those normally associated with forced air convection.<br />

A corollary of the heat flux is that there must be a temperature rise in the<br />

cooling air.<br />

Peak power density (MW/m 2 )<br />

14<br />

12<br />

10<br />

8<br />

6<br />

4<br />

2<br />

0<br />

H s = 10 mm<br />

b hs = 3 cm<br />

b si = 0.5 cm<br />

ρ/ρ s = 0.3<br />

0.1 1 10<br />

Back pressure, ∆p* (kPa)<br />

Figure 17.16 Peak power density as a function of back pressure<br />

Device design issues<br />

To take full advantage of the heat transfer capabilities of the cellular metal,<br />

the thermal design of the device must establish nearly isothermal conditions:<br />

that is, minimal thermal resistance between the electronics and the heat sink<br />

surface. This can be achieved by combining a high thermal conductivity<br />

aluminum nitride dielectric with a copper planar micro-heat-pipe, fully integrated<br />

with the heat sink by brazing (in order to exclude high thermal resistance<br />

at the interfaces Ł ). Simulated temperatures for this scenario indicate that the<br />

required isothermality can be realized: albeit that the associated manufacturing<br />

requirements are stringent and yet to be demonstrated.<br />

17.9 Applications under consideration<br />

Skin-stiffened structures become more weight-efficient if the skin itself is a<br />

sandwich structure. This issue is discussed in some detail in Chapter 10, in<br />

Ł Applications of polymer bonding and thermal greases would violate these requirements.

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