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Metal Foams: A Design Guide

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Maximum power density at electronics (MW/m 2 )<br />

10 3<br />

10 2<br />

Boiling<br />

point limit<br />

10<br />

1<br />

q = h (T j −T air)<br />

SiC<br />

electronics<br />

Air<br />

cooling<br />

Goal, mesocell<br />

Fuel<br />

cooling<br />

Conventional<br />

(b hs = 25cm)<br />

Cu micro<br />

heat pipe<br />

b hs = 3cm<br />

Si<br />

electronics<br />

0.1 1 10 100<br />

Heat transfer coefficient (kW/m 2 K)<br />

Case studies 229<br />

Figure 17.14 Upper limits on power density and heat-transfer coefficient<br />

This case study illustrates the benefits of using a cellular metal sink to cool<br />

power electronic devices. Analytical results provide upper bounds. Numerical<br />

simulations provide explicit operating benefits. The overall goal is to reduce<br />

the volume of the drive needed to operate, say, a 75 hp motor (relative to<br />

conventional IGBT modules) while increasing its durability and decreasing<br />

its cost.<br />

Requirements<br />

If two-sided cooling is used to double the heat flux achievable at the electronics,<br />

there is a maximum achievable flux at the sink, q Ł . This occurs when<br />

the device located between the electronics and the surface of the sink is<br />

designed to be nearly isothermal and equal to the junction temperature, Tj,<br />

q Ł D h⊲Tj Tf⊳ ⊲17.2⊳

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