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tesi R. Miscioscia.pdf - EleA@UniSA

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Gate-leakages 101<br />

modeled with a constant voltage source. The proposed model has<br />

allowed to estimate the channel mobility and the voltage threshold.<br />

The mobility values of the devices estimated with the model<br />

agrees with the SEM analysis. Further investigations will show<br />

(chapter 3) that in the case of different topologies and dielectrics, the<br />

variation of charge mobility with gate field will make sometimes notconsistent<br />

the fits made with a model having a power-law dependence<br />

of current from voltages as in the examined case.<br />

3.7 Layout design impact of the gate-leakage<br />

analysis<br />

Gate leakages are often a hidden problem in many literature<br />

reports. They become relevant when working on very thin insulating<br />

films or leaky dielectrics like polymers or solution-processed<br />

materials and are responsible of static dissipation in OFET-based<br />

circuitry.<br />

From observations of this chapter’s data analysis we can state that<br />

the PI offers the best performances once annealed: in terms of<br />

mobility: 0.72 cm 2 V -1 s -1 with a negligible gate leakage IG<br />

The drawback of Polyimide utilization are the high operating voltages<br />

(0,-100V), the it should be necessary to fabricate thinner dielectrics to<br />

increase the insulator’s capacity Cins.<br />

Unfortunately, we were not able to process PI layers under the<br />

1µm thickness without obtaining gate short-circuits. But a way to<br />

reduce active area under contacts had to be found to optimize devices<br />

not only in terms of mobility but thresholds, gate leakages, operating<br />

voltages and so on.<br />

Being the overlap between S/D contacts in large part responsible<br />

of such non-ideality effects, to improve performances we had to move<br />

to a process/layout with patterned gates/islands. In this line of work<br />

we can take into account three chances:<br />

• OSC subtraction.<br />

This is usual in inorganic devices where organics are<br />

used just to make patterning and removed with solvents. Thus,<br />

inorganic technology is for its nature orthogonal to patterning<br />

technology. This method is not actable without any precaution

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