tesi R. Miscioscia.pdf - EleA@UniSA
tesi R. Miscioscia.pdf - EleA@UniSA
tesi R. Miscioscia.pdf - EleA@UniSA
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Gate-leakages 101<br />
modeled with a constant voltage source. The proposed model has<br />
allowed to estimate the channel mobility and the voltage threshold.<br />
The mobility values of the devices estimated with the model<br />
agrees with the SEM analysis. Further investigations will show<br />
(chapter 3) that in the case of different topologies and dielectrics, the<br />
variation of charge mobility with gate field will make sometimes notconsistent<br />
the fits made with a model having a power-law dependence<br />
of current from voltages as in the examined case.<br />
3.7 Layout design impact of the gate-leakage<br />
analysis<br />
Gate leakages are often a hidden problem in many literature<br />
reports. They become relevant when working on very thin insulating<br />
films or leaky dielectrics like polymers or solution-processed<br />
materials and are responsible of static dissipation in OFET-based<br />
circuitry.<br />
From observations of this chapter’s data analysis we can state that<br />
the PI offers the best performances once annealed: in terms of<br />
mobility: 0.72 cm 2 V -1 s -1 with a negligible gate leakage IG<br />
The drawback of Polyimide utilization are the high operating voltages<br />
(0,-100V), the it should be necessary to fabricate thinner dielectrics to<br />
increase the insulator’s capacity Cins.<br />
Unfortunately, we were not able to process PI layers under the<br />
1µm thickness without obtaining gate short-circuits. But a way to<br />
reduce active area under contacts had to be found to optimize devices<br />
not only in terms of mobility but thresholds, gate leakages, operating<br />
voltages and so on.<br />
Being the overlap between S/D contacts in large part responsible<br />
of such non-ideality effects, to improve performances we had to move<br />
to a process/layout with patterned gates/islands. In this line of work<br />
we can take into account three chances:<br />
• OSC subtraction.<br />
This is usual in inorganic devices where organics are<br />
used just to make patterning and removed with solvents. Thus,<br />
inorganic technology is for its nature orthogonal to patterning<br />
technology. This method is not actable without any precaution