tesi R. Miscioscia.pdf - EleA@UniSA
tesi R. Miscioscia.pdf - EleA@UniSA
tesi R. Miscioscia.pdf - EleA@UniSA
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Chapter 2 61<br />
figure 31: OTFT realized by means SAMT dielectric on ITO gate and on a Mylar substrate [37]<br />
2.7 Source and Drain electrodes in OTFTs<br />
Strictly thinking to the materials involved in the realization, the<br />
performance of an organic transistor depend, and of course, not only<br />
from the properties of the semiconductor channel and of the gate<br />
insulator, but also from the physical-chemical properties of the source<br />
and drain contacts that are responsible for the injection of carriers<br />
modulated by the effect of the field within the channel region. In<br />
particular, it is clear those technologically attractive electrodes, in<br />
order to minimize the ohmic losses, have a high conductivity and at<br />
the same time they are characterized by a low contact resistance (Rs)<br />
which is often a critical factor in OFET operation (reduces the drain<br />
current).<br />
In addition, the interface between the electrodes and the<br />
channel is comparable to a metal/semiconductor junction and it is<br />
necessary to pay particular attention to the electrical characteristics of<br />
the resulting device realized by the junction itself. The contact should<br />
have an ohmic characteristic and this goal is achieved depends on the<br />
barrier between the energy levels related to the contacts and the<br />
channel.<br />
The reduction of this barrier is obtained, for a given<br />
semiconductor, by choosing the appropriate material with which<br />
realize the Source and Drain, as well as by the adoption of process<br />
improvements and interface treatments. Equally important, as regards<br />
the feasibility of a particular transistor and its integration in complex<br />
logic, are the possibility to realize a patterned structure of the