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tesi R. Miscioscia.pdf - EleA@UniSA

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Chapter 2 61<br />

figure 31: OTFT realized by means SAMT dielectric on ITO gate and on a Mylar substrate [37]<br />

2.7 Source and Drain electrodes in OTFTs<br />

Strictly thinking to the materials involved in the realization, the<br />

performance of an organic transistor depend, and of course, not only<br />

from the properties of the semiconductor channel and of the gate<br />

insulator, but also from the physical-chemical properties of the source<br />

and drain contacts that are responsible for the injection of carriers<br />

modulated by the effect of the field within the channel region. In<br />

particular, it is clear those technologically attractive electrodes, in<br />

order to minimize the ohmic losses, have a high conductivity and at<br />

the same time they are characterized by a low contact resistance (Rs)<br />

which is often a critical factor in OFET operation (reduces the drain<br />

current).<br />

In addition, the interface between the electrodes and the<br />

channel is comparable to a metal/semiconductor junction and it is<br />

necessary to pay particular attention to the electrical characteristics of<br />

the resulting device realized by the junction itself. The contact should<br />

have an ohmic characteristic and this goal is achieved depends on the<br />

barrier between the energy levels related to the contacts and the<br />

channel.<br />

The reduction of this barrier is obtained, for a given<br />

semiconductor, by choosing the appropriate material with which<br />

realize the Source and Drain, as well as by the adoption of process<br />

improvements and interface treatments. Equally important, as regards<br />

the feasibility of a particular transistor and its integration in complex<br />

logic, are the possibility to realize a patterned structure of the

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