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tesi R. Miscioscia.pdf - EleA@UniSA

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Gate-leakages 89<br />

The results are:<br />

= 35.4 nm Polyimide<br />

= 35.1 nm Polystyrene<br />

= 37.8 nm Resist<br />

These data do not show relevant differences in the films structure.<br />

3.3.2 Electrical characterization and device modeling<br />

figure 6 shows that the output characteristics for the PI sample,<br />

before the annealing process, fail zero-crossing at VDS = 0 V. This<br />

effect can be attributed to a leaky gate insulator [10]. Moreover, since<br />

the sample revealed a symmetric Drain-Source behaviour, we can<br />

suppose the leakage current to be IS = ID = IG/2 at VDS = 0 V, as stated<br />

in [10].<br />

Plotting IS(VDS = 0 V) vs. VGS (see figure 4), a quadratic trend can<br />

be noticed. This result is common in many dielectric materials with<br />

trap-free Space-Charge Limited Current behaviour (SCLC). Thus the<br />

parasitic currents between the Drain contact and the Gate can be<br />

modeled by IG~VGD 2 obtaining:<br />

eq. 1 = −K<br />

( V −V<br />

)<br />

2<br />

2<br />

[ V −V<br />

] − V<br />

I S 2 GS T DS DS α DG<br />

where α can be named non-ideality factor.

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