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116 Exceptions in morphology-mobility relationship necessary to modulate the channel current[21]. As we can state by observing table 4, film roughness increases of few Angstroms when film is deposited on the glass substrate. For the sake of our investigation similar values of mean roughness have been obtained, therefore a comparison can be considered consistent from this point of view. 3.2.3 Sol-gel PFTEOS:TEOS processing When PFTEOS and TEOS are put in solution, the silicic derivatives hydrolyze giving Si-OH groups which are able to undergo to condensation. Such condensation process happens when the material is in its thin-film phase (after spin-coating) by means of thermal curing at 150°C. During this process the material forms networks of chemical bindings between functionalized Si-O-Si and perfluoroalkyl groups which tend to migrate to the film surface giving rise to enhanced hydrophobic interface properties[22] (see figure 2). figure 2: schematization of perfluoroalkyl groups localization on PFTEOS:TEOS film surface The described sol-gel process is summarized in figure 3
Chapter 4 117 figure 3: PFTEOS:TEOS sol-gel process schematization hydrolysis condensation condensation
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Università degli Studi di Salerno
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Acknowledgments It is a pleasure to
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In loving memory of my uncle, Profe
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Introduction Nowadays, it has becom
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Introduction 3 The drawbacks of org
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Introduction 5 Artificial Skin (OTF
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Introduction 7 structure has been d
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Chapter 1 Working principles An Org
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Chapter 1 11 1.1 A model for DC beh
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Chapter 1 13 hp. 4) Decoupling betw
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Chapter 1 15 figure 2: integration
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Chapter 1 17 eq. 11 − = Then, bei
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Chapter 1 19 The formula in eq. 18
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Chapter 1 21 and behaves as a resis
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Chapter 1 23 eq. 22 I DS = μ C ins
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Chapter 1 25 In eq. 27, kB is the B
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Chapter 1 27 eq. 30 · Thu
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Chapter 2 A survey on the state of
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Chapter 2 31 emphasizing the role p
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Chapter 2 33 Only after those years
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Chapter 2 35 In fact, usually the m
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Chapter 2 37 Examples of top-gate b
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Chapter 2 39 deposition process of
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Chapter 2 41 region is patterned by
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Chapter 2 43 figure 11: Non-Relief-
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Chapter 2 45 factor analysing, in p
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Chapter 2 47 In literature results,
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Chapter 2 49 It is clear that the c
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Chapter 2 51 In figure 17 the impro
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Chapter 2 53 figure 19: OFET trans-
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Chapter 2 55 figure 22: Comparison
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Chapter 2 57 channel and gate in Pe
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Chapter 2 59 figure 28: Pentacene b
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Chapter 2 61 figure 31: OTFT realiz
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Chapter 2 63 materials, the higher
Page 71 and 72: Chapter 2 65 The effect of the barr
Page 73 and 74: Chapter 2 67 figure 36: potential p
Page 75 and 76: Chapter 2 69 From table 2, it is ea
Page 77 and 78: Chapter 2 71 thermal-budget treatme
Page 79 and 80: Chapter 2 73 in particular in OLEDs
Page 81 and 82: Chapter 2 75 One interesting charac
Page 83 and 84: Chapter 2 77 figure 48: electrical
Page 85 and 86: Chapter 2 79 The research on the OE
Page 87 and 88: Chapter 2 81 photolysis). In this p
Page 89 and 90: Chapter 2 83 [26] Facchetti, Wasiel
Page 91 and 92: Chapter 3 Gate-leakages in polymeri
Page 93 and 94: Gate-leakages 87 determined by XRD
Page 95 and 96: Gate-leakages 89 The results are:
Page 97 and 98: Gate-leakages 91 It has to be consi
Page 99 and 100: Gate-leakages 93 figure 8: Output c
Page 101 and 102: Gate-leakages 95 figure 12: electri
Page 103 and 104: Gate-leakages 97 3.4 Advanced circu
Page 105 and 106: Gate-leakages 99 figure 16: SEM ima
Page 107 and 108: Gate-leakages 101 modeled with a co
Page 109 and 110: Gate-leakages 103 eq. 11 • Shadow
Page 111 and 112: Gate-leakages 105 References [1] R.
Page 113 and 114: Chapter 4 Morphology-mobility relat
Page 115 and 116: Chapter 4 109 insulators to increas
Page 117 and 118: Chapter 4 111 3.2 General device st
Page 119 and 120: Chapter 4 113 Pentacene islands are
Page 121: Chapter 4 115 For the preparation o
Page 125 and 126: Chapter Chapter 4 4 119 (a): (a):
Page 127 and 128: Chapter 4 121 3.4 Device’s charac
Page 129 and 130: Chapter 4 123 mobility with the dim
Page 131 and 132: Chapter 4 125 As it can be observed
Page 133 and 134: Chapter 4 127 eq. 4 Where r
Page 135 and 136: Chapter 4 129 3.4.3 Thermal charact
Page 137 and 138: Chapter 4 131 Ea(eV) 0.50 0.45 0.40
Page 139 and 140: Chapter 4 133 I D (A) 100.0n 80.0n
Page 141 and 142: Chapter 4 135 μ (cm 2 V -1 s -1 )
Page 143 and 144: Chapter 4 137 T MN (K) 2400 2200 20
Page 145 and 146: Chapter 4 139 Such results, supply
Page 147 and 148: Chapter 4 141 References [1] O. D.
Page 149 and 150: Chapter 4 143 [26] P. Palestri, D.
Page 151 and 152: Conclusions In this PhD dissertatio
Page 153 and 154: Introduction 147 characterizing mor
Page 155 and 156: Table of acronyms and symbols Symbo
Page 157: Table of acronyms and symbols _____
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