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Superconducting Technology Assessment - nitrd

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Supplying DC current to all of the SCE chips in parallel would result in a total current of many kiloAmperes. Several<br />

methods may be used to reduce this total current and heat load. One technique is to supply DC current to the SCE<br />

chips in series, rather than in parallel (current recycling) taking advantage of very low resistances of lines in SCE<br />

circuits. However, it would require true differential signal propagation across floating ground planes. High<br />

temperature superconductor (HTS) cables may be used to bring in DC current from 77 K to the 4 K environment.<br />

Another solution is to use switching power supplies: high voltages/low currents can be brought near SCE circuits<br />

and conversion to low voltages/high currents, all at DC, can occur at the point of use. However, this method<br />

employs high power field-effect transistor switches, which themselves can dissipate significant power.<br />

Of these methods, current recycling shows the most near-term promise. Laboratory level experiments were<br />

conducted for small scale systems. The demonstration of a large-scale SCE system with kiloAmperes of current was<br />

not performed yet. For smaller IO counts, coaxial cables can be used for both high and medium-speed lines. Coax<br />

cables have different sections. The middle section is a short length of stainless steel coaxial cable that has a<br />

high thermal resistance and a bottom section of non-magnetic Cu coaxial cable for penetration into the<br />

magnetically-shielded chip housing. For higher-frequency input signal up to 60 GHz and clock lines, Gilbert-<br />

Corning GPPO connectors are used. Flexible BeCu microstrip ribbon cables were also considered for medium speed<br />

output lines. At 1 GHz, electrical attenuation and heat conduction of these ribbon cables were measured to be<br />

nearly identical to the tri-section coax cable. Modified connector assemblies were tested at room temperature and<br />

at liquid nitrogen temperature and found to be within specification for both reflection and attenuation.<br />

For systems with hundreds or thousands of I/O lines, coaxial cables are not practical. To meet this challenge flexible<br />

ribbon cables have been developed 8 . These cables consist of two or three layers of copper metallization separated<br />

by dielectric films, typically polyimide. With three copper layers, the outer two layers serve as ground planes and<br />

the inner layer forms the signal lines, creating a stripline configuration. Stripline cables provide excellent shielding<br />

for the signal lines. The dielectric layers consisted of 2 mil thick polyimide films. The ground planes were fabricated<br />

from 0.6 micron-thick sputtered-copper films, while the signal lines were patterned from a 4-micron-thick<br />

plated-copper film. The signal line width was 3 mils for 50Ω impedance with a pitch of 70 mils and each cable has<br />

more than hundred leads. In addition to large I/O count and multi-GHz connections, flexible ribbon cables offer the<br />

advantage of low thermal conduction to the cold stage. Cables can be manufactured with copper films the<br />

thickness of the electrical skin depth for a particular frequency of interest. Successful cable-attach procedures with<br />

high reliability and low cost were also demonstrated. Signal speeds up to 3 GHz were experimentally demonstrated.<br />

The construction of the cable should allow operation up to 20GHz after minor modifications.<br />

Interposer Board<br />

LNA Board<br />

Interposer Strip<br />

Dewar Wall<br />

Breakout<br />

Board<br />

Heat stationed<br />

at cold pedestal<br />

Heat stationed<br />

at 1st stage<br />

Substrate with traces connecting<br />

input and output lines<br />

Interposer Board<br />

Interposer Strip<br />

Cable<br />

Metal pads<br />

Indium bumps<br />

Figure 12. A high-speed flexible ribbon cable designed for modular attachment (Ref: NGST).<br />

8<br />

“Cryogenic Packaging for Multi-GHz Electronics” T. Tighe et al, IEEE Tran. Applied Superconductivity, Vol 9 (2), pp3173-3176, 1999.<br />

240

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