1Gb: x8, x16 Automotive DDR2 SDRAM - Micron

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ACTIVATE Before any READ or WRITE commands can be issued to a bank within the DDR2 SDRAM, a row in that bank must be opened (activated), even when additive latency is used. This is accomplished via the ACTIVATE command, which selects both the bank and the row to be activated. After a row is opened with an ACTIVATE command, a READ or WRITE command may be issued to that row subject to the tRCD specification. tRCD (MIN) should be divided by the clock period and rounded up to the next whole number to determine the earliest clock edge after the ACTIVATE command on which a READ or WRITE command can be entered. The same procedure is used to convert other specification limits from time units to clock cycles. For example, a tRCD (MIN) specification of 20ns with a 266 MHz clock ( tCK = 3.75ns) results in 5.3 clocks, rounded up to 6. This is shown in Figure 41, which covers any case where 5 < tRCD (MIN)/ tCK ≤ 6. Figure 41 also shows the case for tRRD where 2 < tRRD (MIN)/ tCK ≤ 3. Figure 41: Example: Meeting t RRD (MIN) and t RCD (MIN) CK# CK Command Address Bank address T0 T1 T2 T3 T4 T5 T6 T7 ACT NOP NOP ACT NOP NOP NOP NOP NOP RD/WR Row Row Row Col Bank x Bank y t RRD t RRD 1Gb: x8, x16 Automotive DDR2 SDRAM ACTIVATE t RCD T8 T9 Bank z Bank y Don’t Care A subsequent ACTIVATE command to a different row in the same bank can only be issued after the previous active row has been closed (precharged). The minimum time interval between successive ACTIVATE commands to the same bank is defined by tRC. A subsequent ACTIVATE command to another bank can be issued while the first bank is being accessed, which results in a reduction of total row-access overhead. The minimum time interval between successive ACTIVATE commands to different banks is defined by tRRD. DDR2 devices with 8 banks (1Gb or larger) have an additional requirement: tFAW. This requires no more than four ACTIVATE commands may be issued in any given tFAW (MIN) period, as shown in Figure 42 (page 87). PDF: 09005aef840eff89 1gbddr2_ait_aat.pdf – Rev. C 7/11 EN 86 Micron Technology, Inc. reserves the right to change products or specifications without notice. � 2010 Micron Technology, Inc. All rights reserved.
Figure 42: Multibank Activate Restriction CK# CK Command Address Bank address T0 T1 T2 T3 T4 T5 T6 T7 ACT READ ACT READ ACT READ ACT READ NOP NOP Row Col Row Bank a Bank a t RRD (MIN) Bank b Col Row Col Row Col 1Gb: x8, x16 Automotive DDR2 SDRAM ACTIVATE t FAW (MIN) T8 T9 Bank b Bank c Bank c Bank d Bank d Bank e T10 ACT Row Don’t Care Note: 1. DDR2-533 (-37E, x4 or x8), t CK = 3.75ns, BL = 4, AL = 3, CL = 4, t RRD (MIN) = 7.5ns, t FAW (MIN) = 37.5ns. PDF: 09005aef840eff89 1gbddr2_ait_aat.pdf – Rev. C 7/11 EN 87 Micron Technology, Inc. reserves the right to change products or specifications without notice. � 2010 Micron Technology, Inc. All rights reserved.
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Automotive DDR2 SDRAM MT47H128M8 -
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1Gb: x8, x16 Automotive DDR2 SDRAM
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Functional Description Automotive I
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Functional Block Diagrams The DDR2
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Ball Assignments and Descriptions F
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Table 3: FBGA 84-Ball - x16 and 60-
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Packaging Package Dimensions Figure
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FBGA Package Capacitance Table 4: I
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Table 6: Temperature Limits Paramet
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I DD7 Conditions The detailed timin
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Table 10: DDR2 I DD Specifications
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PDF: 09005aef840eff89 Micron Techno
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Page 35 and 36: PDF: 09005aef840eff89 Micron Techno
Page 39 and 40: AC and DC Operating Conditions Tabl
Page 41 and 42: Input Electrical Characteristics an
Page 43 and 44: 1Gb: x8, x16 Automotive DDR2 SDRAM
Page 45 and 46: Table 19: Output Characteristics Pa
Page 47 and 48: Figure 15: Full Strength Pull-Up Ch
Page 49 and 50: Figure 17: Reduced Strength Pull-Up
Page 51 and 52: AC Overshoot/Undershoot Specificati
Page 53 and 54: Input Slew Rate Derating 1Gb: x8, x
Page 57 and 58: Figure 23: Nominal Slew Rate for t
Page 61 and 62: Table 34: Single-Ended DQS Slew Rat
Page 63 and 64: Figure 27: Nominal Slew Rate for t
Page 65 and 66: Figure 31: AC Input Test Signal Wav
Page 67 and 68: 6. Bank addresses (BA) determine wh
Page 69 and 70: Table 38: Truth Table - Current Sta
Page 71 and 72: NO OPERATION (NOP) LOAD MODE (LM) A
Page 73 and 74: Burst Length Figure 33: MR Definiti
Page 75 and 76: Write Recovery Power-Down Mode 1Gb:
Page 77 and 78: Extended Mode Register (EMR) Figure
Page 79 and 80: On-Die Termination (ODT) ODT effect
Page 81 and 82: Extended Mode Register 2 (EMR2) Fig
Page 85: 1Gb: x8, x16 Automotive DDR2 SDRAM
Page 89 and 90: Figure 43: READ Latency CK# CK Comm
Page 91 and 92: Figure 45: Nonconsecutive READ Burs
Page 93 and 94: Figure 48: READ-to-PRECHARGE - BL =
Page 95 and 96: Figure 50: Bank Read - Without Auto
Page 97 and 98: Figure 52: x4, x8 Data Output Timin
Page 99 and 100: Figure 54: Data Output Timing - t A
Page 101 and 102: Figure 55: Write Burst CK# CK Comma
Page 103 and 104: Figure 58: WRITE Interrupted by WRI
Page 105 and 106: Figure 60: WRITE-to-PRECHARGE CK# C
Page 107 and 108: Figure 62: Bank Write - with Auto P
Page 109 and 110: Figure 64: Data Input Timing PRECHA
Page 111 and 112: SELF REFRESH 1Gb: x8, x16 Automotiv
Page 113 and 114: Power-Down Mode 1Gb: x8, x16 Automo
Page 115 and 116: Table 43: Truth Table - CKE 1Gb: x8
Page 117 and 118: Figure 70: WRITE-to-Power-Down or S
Page 119 and 120: Figure 74: PRECHARGE Command-to-Pow
Page 121 and 122: Reset CKE Low Anytime 1Gb: x8, x16
Page 123 and 124: ODT Timing 1Gb: x8, x16 Automotive
Page 125 and 126: MRS Command to ODT Update Delay Dur
Page 127 and 128: Figure 83: ODT Turn-On Timing When
Page 129: Figure 85: ODT Turn-On Timing When
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1Gb: x8, x16 Automotive DDR2 SDRAM - Micron

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