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ICMCTF 2012! - CD-Lab Application Oriented Coating Development

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esidual stress and to the Poisson’s ratio of the coating. This is done by<br />

adopting a unique novel geometry for the milled trench and by means of<br />

digital image correlation (DIC) techniques and ad hoc constitutive models.<br />

The method consists of two sequential steps: (1) FIB milling of two parallel<br />

slots and analysis of the consequent relaxation strain that might occur in the<br />

central area (along the X-direction which is the direction perpendicular to<br />

the slots); (2) milling of two additional slots along a direction perpendicular<br />

to the previous one, so to induce a full biaxial stress relief of the central<br />

square island. The analysis of the relaxation strain after the second milling<br />

step is then performed along the same X-direction. The depth of all trenches<br />

and the distance between them are kept equal to the coating’s thickness. The<br />

relaxation strain analysis is performed by means of high-resolution in-situ<br />

SEM-FEG imaging of the relaxing surface and a full field strain analysis by<br />

digital image correlation (DIC).<br />

A FE modeling approach was also used to demonstrate that, for a wide<br />

range of isotropic materials, the ratio between the two acquired X-strains is<br />

a unique simple function of the Poisson’s ratio of the coatings,<br />

independently of the elastic modulus. Furthermore, the analysis of the X<br />

and Y relaxation strains at each milling step allows the direct evaluation of<br />

the residual stress depth profile in the coating.<br />

The model was experimentally validated on a 3.0 µm CAE-PVD Chromium<br />

Nitride (CrN) coating.<br />

An equal-biaxial average stress of -5.04 ± 0.75 GPa was detected and found<br />

to be in good agreement with that obtained by XRD (adopting the same<br />

elastic constants). Moreover, a Poisson’s ratio of 0.23 ± 0.02 was estimated,<br />

which is in the range reported in the literature for similar coatings.<br />

The two situations of non-equal biaxial stress and non-isotropic in-plane<br />

elastic behavior are analyzed and correcting equations are proposed.<br />

Finally, the influence of coating’s texture and microstructure on the<br />

reliability of the method is discussed.<br />

2:10pm TS2-2-3 Low temperature deformation in complex crystals, V.<br />

Schnabel, University of Cambridge, UK, S. Korte, Gordon <strong>Lab</strong>oratory,<br />

Department of Materials Science and Metallurgy, University of Cambridge,<br />

UK, C. Walter, R. Stearn, W. Clegg (wjc1000@cam.ac.uk), University of<br />

Cambridge, UK<br />

The development of new materials for coatings has generally focussed on a<br />

limited number of materials with relatively simple crystal structures in<br />

which deformation occurs predominantly by the movement of dislocations.<br />

However there are crystals with unit cells that are sufficiently large that<br />

conventional dislocations are energetically unfavourable. Despite this, such<br />

materials are known to be plastic above a ductile-brittle temperature,<br />

typically 0.5 – 0.75 of the melting point.<br />

In this paper the low temperature deformation behaviour of single crystals<br />

of an orthorhombic Al13Co4 and a cubic Mg2Al3 has been studied at<br />

temperatures using micropillar compression. This allows cracking to be<br />

suppressed by making the sample sufficiently small, in this case a few<br />

microns in diameter. The materials studied had grains of a sufficient size<br />

that micropillars could be milled within individual grains, allowing the<br />

single crystal flow behaviour in grains of different orientations to be<br />

studied. It is shown that there is a very pronounced yield drop in these<br />

materials, and that the yield stress appears to be almost independent of<br />

temperature, similar to what has been observed in a metallic glasses. In<br />

some orientations, the orientations of the slip traces with respect to the pillar<br />

orientation were consistent with what would be expected from the slip<br />

systems at higher temperatures. However, this was not observed in many<br />

cases, suggesting that the glide bands form on or close to planes of<br />

maximum shear stress.<br />

2:30pm TS2-2-4 Carbon-Based <strong>Coating</strong> for Flexible Fabric Heater<br />

Prepared by Arc Ion Plating, C.C. Hsu, C.M. Chen, J.L. He<br />

(jlhe@fcu.edu.tw), Feng Chia University, Taiwan<br />

Electric heating textiles have widely been used in many applications,<br />

including clothes, furnishings and medical equipments, as well as in recent<br />

year, the car or construction interior materials. The traditional metal wire<br />

and carbon fiber are currently the two major types of heating element for<br />

electric heating textiles. The former suffers non-uniform heating, easy<br />

corrosion, uncomfortable to the user and without far infrared emission,<br />

while the carbon fabric presents area heating, flexible and particular far<br />

infrared emission. However, the carbonization process to prepare carbon<br />

fiber is expensive, energy consuming and emitting environmental<br />

unfriendly VOCs. Carbon-based coatings such as diamond-like carbon<br />

(DLC) film presents high chemical stability and effective far infrared<br />

emission. Therefore, in this study, an arc ion plating (AIP) technique,<br />

capable of low temperature deposition, is used to prepare carbon-based film<br />

on glass fiber fabric, and thus a flexible fabric heater with low processing<br />

cost and far infrared emission capability is expected. By adjusting the<br />

acetylene flow rate during deposition, the film composition and phase<br />

structure are investigated to reveal how they affect the electrical properties<br />

and far infrared emissivity. Experimental results show that the AIP carbonbased<br />

film presents a lower electrical resistivity as well as thermal-electrical<br />

conversion efficiency when obtained at low acetylene flow rate, but an<br />

ultimate far infrared emissivity when obtained at high acetylene flow rate.<br />

Such a newly developed flexible fabric heater has been a great potential for<br />

usage in the electric heating products.<br />

2:50pm TS2-2-5 Kinetics of Thin Film Growth and Gas-Solid<br />

Reactions using in situ High-Temperature Scanning Tunneling<br />

Microscopy, S. Kodambaka (kodambaka@ucla.edu), Y. Murata,<br />

University of California, Los Angeles, US, V. Petrova, I. Petrov, University<br />

of Illinois at Urbana-Champaign, US INVITED<br />

In situ microscopy is a powerful method that enables direct visualization of<br />

surface morphological, structural, compositional evolution, and often<br />

reveals surprising and previously unknown aspects. Since the observations<br />

are carried out at the processing conditions (for example, during growth or<br />

annealing in vacuum or in a reactive ambient), the phenomena can be<br />

quantitatively described with minimal uncertainties in kinetic rate<br />

measurements. In this talk, I will showcase the capabilities of in situ<br />

variable-temperature scanning tunneling microscopy (VT-STM) using two<br />

examples: 1) growth of graphene thin films on SiC(0001) and 2) gas-solid<br />

reactions on TiO2(110).<br />

In order to follow graphene growth on SiC surfaces, we used hightemperature<br />

(~ 1400 K) STM and observed for changes occurring on the<br />

SiC(0001) during annealing in ultra-high vacuum. From the time-lapsed<br />

STM images, we identify three distinct modes of bilayer graphene growth.<br />

We used VT-STM at temperatures between 700 K and 1000 K and studied<br />

the influence of ethylene (C2H4) on the surface dynamics of rutile-structured<br />

TiO2(110). STM images were acquired as a function of time, oxygen and<br />

ethylene partial pressure, and temperature. From the STM images, we<br />

determined the role of gas chemistry on the oxide surface composition.<br />

3:30pm TS2-2-7 In-situ AFM studies of crack initiation in ultra-thin<br />

SiOx films on polymer substrates., B. Ozkaya (oezkaya@tc.unipaderborn.de),<br />

University of Paderborn, Germany, S. Steves, Ruhr<br />

Universität Bochum, Germany, C.N. Liu, O. Ozcan, University of<br />

Paderborn, Germany, P. Awakowicz, Ruhr Universität Bochum, Germany,<br />

G. Grundmeier, University of Paderborn, Germany<br />

Barrier properties of thin films with respect to the diffusion of oxygen and<br />

water are of crucial importance in assessing their protection performance.<br />

Thin SiOx plasma polymer films have been intensively researched for their<br />

possible application as barrier coatings on engineering metals. Their high<br />

formability makes them suitable for applications involving forming<br />

processes; whereas their superior barrier properties prevent corrosive<br />

electrolytes from reaching the film-metal interface. The key step in the<br />

development of these films is the simultaneous optimisation of the<br />

mechanical and barrier properties to achieve coatings which can hinder the<br />

ingress of electrolyte to the interface and at the same time sustain a high<br />

resistance to crack formation during forming processes.<br />

This paper focuses on crack initiation of SiOx plasma polymer films.<br />

Various films are deposited in a low pressure microwave plasma to study<br />

the effect of process parameters (plasma gas composition, substrate bias and<br />

adhesion promoting pre-treatments) on film properties. For the investigation<br />

of deformation at various strain values, plasma polymer films were applied<br />

on PET-foils and the crack formation was studied in-situ by means of<br />

atomic force microscopy (AFM). A custom build AFM-stage was used to<br />

apply the desired strain in a perfectly controlled manner. Moreover, the<br />

evaluation of water up-take in barrier films was performed on films<br />

deposited on gold electrodes by means of discrete polarisation modulation<br />

Fourier transform infrared reflection-absorption spectroscopy (FT-IRRAS)<br />

and by collection of cyclic voltammetry data, in atmospheres with<br />

controlled humidity and in corrosive electrolytes, respectively. Presented<br />

results will demonstrate the correlation between the deposition parameters<br />

and crack formation mechanisms. The understanding of the interplay<br />

between the plasma parameters and the observed barrier properties will<br />

enable the design of high performance thin film coatings.<br />

The authors gratefully acknowledge the support provided by the Deutsche<br />

Forschungsgemeinschaft (DFG) within the framework of the SFB-TR 87.<br />

3:50pm TS2-2-8 High Frequency Characterization of Screen-printed<br />

Silver Circuits with an Environmental Reliability Test, K.S. Kim, W.R.<br />

Myung, S.B. Jung (sbjung@skku.ac.kr), Sungkyunkwan University,<br />

Republic of Korea<br />

Printed electronics is a developing alternative to conventional<br />

photolithography as “green technology”. Direct printing techniques such as<br />

inkjet, screen, and gravure printing are adopted to deposit thin films. They<br />

are based on an additive manufacturing, which conductive nanoinks or<br />

nanopastes are printed on the designated positions, thereby are an<br />

21 Monday Afternoon, April 23, <strong>2012</strong>

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