ICMCTF 2012! - CD-Lab Application Oriented Coating Development

Thursday Afternoon Poster Sessions
Symposium TS Poster Session
Room: Golden Ballroom - Session TSP
TS Poster Session
5:00 pm
TSP-1
A route to strong p-doping of epitaxial graphene on SiC, U. SCHWINGENSCHLÖGL,
Y.C. CHENG, N. SINGH, KAUST, Saudi Arabia
TSP-2
Nitrogen Introduced at Interface to Improve Resistance Switching
Characteristics with SiGeOx RRAM Device, Y.E. SYU, National Sun Yat-Sen University,
Taiwan, G.W. CHANG, National Chiao Tung University, Taiwan
TSP-3
Electroluminescence of ZnO nanocrystal in sputtered ZnO-SiO
nanocomposite light-emitting devices, J.T. CHEN, National Cheng Kung University,
Taiwan, W.C. LAI, J.K. SHEU, Y.Y. YANG, Unaffiliated
TSP-4
Sampling the local structure in γ-Al2O3 by XPS analysis of embedded Argon,
M. PRENZEL, A. RASTGOO LAHROOD, A. KORTMANN, T. DE LOS ARCOS, A. VON KEUDELL,
Ruhr Universität Bochum, Germany
TSP-5
Deposition, Microstructure and Mechanical Properties of Mo-doped CeO2
Films Prepared by Pulsed Unbalanced Magnetron Sputtering, I.W. PARK, J.
MOORE, J. LIN, Colorado School of Mines, US, D. HURLEY, M. KHAFIZOV, Idaho National
Laboratory, US, A. EL-AZAB, Florida State University, Florida, US, T. ALLEN, C. YABLINSKY, M.
GUPTA, University of Wisconsin, Wisconsin, J. GAN, Idaho National Laboratory, US, M. MANUEL,
H. HENDERSON, B. VALDERRAMA, University of Florida, US
TSP-6
Effect of stress on the electrical bistability of poly N-vinylcarbazole films, J.C.
WANG, Y.S. LAI, National United University, Taiwan
TSP-7
Thin Film Bond and Mass Density Measurements Using Fourier Transform
Infrared Spectroscopy, S. KING, Intel Corporation, US
TSP-8
Ordered thin film materials with ultra-low thermal conductivity, C. MURATORE, Air
Force Research Laboratory, Thermal Sciences and Materials Branch, US, V. VARSHNEY, UTC/Air
Force Research Laboratory, Thermal Sciences and Materials Branch, US, J.J. GENGLER, Air Force
Research Laboratory, Thermal Sciences and Materials Branch, US, J.J. HU, UDRI/Air Force
Research Laboratory, Thermal Sciences and Materials Branch, US, T.S. SMITH, Air Force Research
Laboratory, Thermal Sciences and Materials Branch, US, J.E. BULTMAN, UDRI/Air Force Research
Laboratory, Thermal Sciences and Materials Branch, US, A. VOEVODIN, Air Force Research
Laboratory, Thermal Sciences and Materials Branch, US
TSP-9
Texture change and off-axis accommodation through film thickness in fcc
structured nitrides, A. KARIMI, A. SHETTY, EPFL, Switzerland
TS-39