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ICMCTF 2012! - CD-Lab Application Oriented Coating Development

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Reaction gases were used CH4 (15 SCCM) and H2 (100 SCCM). Vapor of<br />

B(OCH3)3, the boron source, was carried by H2 carrier gas into the vacuum<br />

chamber with its flow rate of 1 to 6 SCCM. Pressure was 20.0kPa and<br />

microwave power was 1.0 kW. Reaction time was fixed to 3 h. The surface<br />

and cross sectional morphologies of deposits were observed by SEM.<br />

Qualities of the deposits were estimated by Raman spectroscopy. Electrical<br />

resistivities were measured by the four-point probe method.<br />

As a result of the SEM observation, the grain sizes of deposits were 1 to 3<br />

μm. The maximum thickness of 6 μm was obtained for carrier gas flow rate<br />

; 3 SCCM. From the Raman spectra of the deposits, the broad peak at about<br />

500, 1230 cm^-1 and the weak peak at 1333 cm^ -1 were observed for<br />

each samples. These peaks due to including high concentration of boron in<br />

the films. In addition, the intensities of the peaks at 1333 cm^ -1 were<br />

decreased with increasing of the carrier gas flow rate. As a result of the<br />

electrical resistivity measurements by the four-point probe method, the<br />

electrical resistivities of boron-doped diamond films decreased with<br />

increasing of carrier gas flow rate. The minimum electrical resistivity of<br />

2.5×10^ -1Ω・ cm was obtained for carrier gas flow rate ; 6 SCCM.<br />

As a conclusion, the boron-doped diamond films were fabricated with each<br />

carrier gas flow rates. In the Raman spectra of the films, the peaks caused<br />

high boron inclusion were observed.<br />

3:30pm B2-2-7 Low temperature chemical vapor deposition of boroncarbon<br />

films for use in neutron detectors, H. Pedersen<br />

(henke@ifm.liu.se), Linköping University, Sweden, C. Höglund, European<br />

Spallation Source ESS AB/ Linköping University, Sweden, J. Birch, J.<br />

Jensen, A. Henry, Linköping University, Sweden<br />

A novel design for neutron detectors based on the isotope 10 B instead of 3 He<br />

has been suggested by the European Spallation Source (ESS), to overcome<br />

the very limited availability of 3 He. In the detector design, very large area<br />

aluminum blades are coated with a thin film containing high amounts of<br />

10 B. 10 B4C was chosen as the thin film material instead of pure 10 B, since it<br />

is easier to handle in a deposition process and due to its high resistance<br />

towards oxidation and wear. Here we demonstrate the synthesis of thin,<br />

amorphous, boron-carbon films at low temperature (400-600 °C), by<br />

thermally activated CVD using the organoborane triethylboron, B(C2H5)3,<br />

(TEB) as single precursor. Since the neutron detectors will be based on<br />

aluminum, there is an upper temperature limit of approximately 600 °C,<br />

which limits a number of possible CVD-processes and also the aluminum<br />

substrate prevents the use of BCl3 as boron precursor. Deposition by TEB is<br />

done on both single crystalline Si (100) substrates and aluminum plates; the<br />

deposition rate at 600 °C was close to 1 µm/h in argon and 0.35 µm/h in<br />

hydrogen. The film density, as measured by X-ray reflectivity (XRR), for<br />

films deposited at 600 °C in hydrogen was 2.42 g/cm 3 (97 % of bulk B4C)<br />

and 2.14 g/cm 3 (86 % of bulk) for films deposited at 600 °C in argon. The<br />

atomic content of the deposited films were analyzed by Time of Flight<br />

Elastic Recoil Detection Analysis (ToF-ERDA), films with B/C-ratio of 4.6<br />

and 3.6 were deposited at 600 °C in hydrogen and argon respectively, the<br />

hydrogen content in the films was 3-4 at%, regardless of deposition<br />

ambient. Both the film composition and film density was found to vary<br />

significantly with deposition temperature and deposition ambient. Based on<br />

our results, a deposition mechanism for boron-carbon films from TEB,<br />

where the TEB molecule is decomposed to BH3 and hydrocarbons, is<br />

suggested.<br />

3:50pm B2-2-8 Synthesis of diamond/carbon nanotube composite thin<br />

films by chemical vapor deposition, L. Yang, Q. Yang<br />

(qiaoqin.yang@usask.ca), Y. Li, Y. Tang, C. Zhang, L.L. Zhang, University<br />

of Saskatchewan, Canada<br />

Diamond/Carbon nanotube (CNT) composite thin films have been<br />

successfully synthesized on silicon wafers using both microwave plasma<br />

enhanced chemical vapor deposition and hot filament chemical vapor<br />

deposition (CVD) technique. Iron was used as catalyst for CNT growth, and<br />

a mixture of CH4 andH2 gases was used to grow both diamond and CNTs.<br />

The synthesized thin films were characterized by Raman spectroscopy,<br />

transmission electron microscopy, scanning electron microscopy, X-ray<br />

diffraction, nanoanalyzer, and field electron emission measurements. The<br />

results show that diamond was deposited with high nucleation density and<br />

high purity, and the CNTs synthesized can be either randomly distributed or<br />

vertically aligned depending on the deposition conditions. The results has<br />

demonstrated that composite films with well aligned CNT arrays and<br />

nanocrystalline diamond can be achieved and the films exhibit superior<br />

field electron properties including large field enhance factor, excellent<br />

current stability and very low turn on field.<br />

Thursday Afternoon, April 26, <strong>2012</strong> 86<br />

4:10pm B2-2-9 Effects of ammonia/acetylene mixtures on the<br />

properties of carbon films prepared by thermal chemical vapor<br />

deposition, L.H. Lai, S.T. Shiue (stshiue@dragon.nchu.edu.tw), National<br />

Chung Hsing University, Taiwan<br />

When ammonia is added in acetylene to form carbon films using thermal<br />

chemical vapor deposition, effects of different ammonia/acetylene ratios on<br />

the deposition rate and microstructures of carbon films are investigated. The<br />

deposition temperature, working pressure, and deposition time of the<br />

thermal CVD process were set to 1113 K, 8 kPa, and 25 min, respectively.<br />

The total mass flow rate of acetylene and ammonia were kept at 40<br />

cm 3 /min, and five kinds of carbon films were prepared with the<br />

ammonia/acetylene ratio of 0, 4/36, 8/32, 12/28, 16/24, and 20/20.<br />

Experimental results indicate that the deposition rate of carbon films<br />

decreases as the ammonia/acetylene ratio increases. The mean crystallite<br />

size and ordered degree of carbon films increase with increasing the<br />

ammonia/acetylene ratio. Moreover, when the ammonia/acetylene ratio<br />

increases, the carbon films have more sp 3 carbon atoms and shift to<br />

diamond -like. Few nitrogen and hydrogen atoms are incorporated into<br />

carbon films. The deposition rate of carbon films is proportional to the<br />

partial pressure of acetylene with a power of about eighth order, and thus,<br />

the pyrolysis of acetylene with added ammonia is controlled by the<br />

adsorption process of sixteen-carbon species on the substrate. The results of<br />

thermal CVD carbon deposition using acetylene and ammonia are compared<br />

with those using acetylene and nitrogen.<br />

4:30pm B2-2-10 Hollow-Cathode Deposition of Thin Films Via Metal<br />

Hydride Formation and Decomposition, S. Muhl (muhl@unam.mx),<br />

Universidad Nacional Autónoma de México - Instituto de Investigaciones<br />

en Materiales, Mexico, . Lopez, IIM-UNAM, Mexico, Y. Pena-Rodriguez,<br />

Autonomous University of Madrid, Spain<br />

Approximately 30 to 40 years ago the group of Stan Vepřek of the<br />

University of Zurich described that thin films of polycrystalline silicon<br />

could be prepared utilizing a reversible chemical reaction. In their paper<br />

they described how pieces of silicon were exposed to a low-pressure highdensity<br />

hydrogen plasma promoting the formation of volatile silicon<br />

hydride, this was then transported within the reactor to a hot substrate which<br />

caused the decomposition of the hydride and the deposition of the silicon<br />

film.<br />

Hydrogen plasmas have also been used for chemical etching of various<br />

materials and, for example, in the case of the deposition of diamond films<br />

the preferential etching of sp 2 bonded carbon is considered to be of<br />

fundamental importance.<br />

In this paper we describe the etching of a metal (Mo or Ni) by hydrogen<br />

which was plasma-activated in a RF hollow cathode where the water-cooled<br />

cylindrical cathode was lined with the appropriate metal. The metal hydride<br />

vapour generate in the plasma was directed to quartz substrates which were<br />

maintained temperatures in excess of 300 o C. The metal hydride was<br />

thermal decomposed and a thin film of the metal was deposited. A special<br />

substrate heater was constructed such that four quartz substrates could be<br />

simultaneously exposed to the metal hydride vapour, but with each substrate<br />

at a different temperature; each approximately 20 o C less than the<br />

neighbouring one. In this way, depositions under identical conditions could<br />

be carried out at the same time but at four different temperatures. We report<br />

the deposition rate as a function of the substrate temperature and the RF<br />

plasma power applied to the hollow cathode.<br />

Hard <strong>Coating</strong>s and Vapor Deposition Technology<br />

Room: Royal Palm 1-3 - Session B6-2<br />

<strong>Coating</strong> Design and Architectures<br />

Moderator: C. Mitterer, Montanuniversität Leoben, Austria,<br />

M. Stüber, Karlsruhe Institute of Technology, Germany<br />

1:30pm B6-2-1 A Knowledge-Based Approach for Optimized <strong>Coating</strong><br />

Architecture, R. Daniel (Rostislav.Daniel@unileoben.ac.at), J. Keckes, C.<br />

Mitterer, Montanuniversität Leoben, Austria INVITED<br />

Physical properties of nanocrystalline thin films are strongly related to their<br />

structure. It, in turn, depends on the deposition conditions, which affect<br />

atomistic processes acting during film growth. An understanding of the<br />

growth-structure-property relations in thin solid films is thus crucial in<br />

optimizing their performance. The attempt of this study is to reveal the<br />

origin of depth-profile variations in film texture, morphology, stress state<br />

and thermal properties based on the evolutionary nature of the film structure<br />

due to competitive growth. We will demonstrate how the variation in the<br />

stress state and thermal properties is related to the volume fraction of grain<br />

boundaries, which typically develops in nanocrystalline films to a different

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