Eliete Pereira - LEPTEN - Universidade Federal de Santa Catarina

REFERÊNCIAS BIBLIOGRÁFICAS 84REFERÊNCIAS BIBLIOGRÁFICASArtigosAdnadevic, B., Janlovic, B., Kolar-Anic, Lj., Minic, D., 2007, “Normalized WeibullDistribution Function for Modeling the Kinetics of Non-isothermal Dehydration of EquilibriumSwollen Poly (Acrylic Acid) Hidrogel” Chemical Engineering Journal 130, pp 11-17.Aron, W. and Colombo G., 1963, “Controlling Factors of Thermal ConductanceAcross Bolted Joints in a Vacuum Environment,” ASME Paper, No. 63-WA-196.Bahrami, M., Culham, J.R., Yovanovich, M.M., Culham, J. R., Março 2005, “ThermalContact Resistance: Effect of Elastic Deformation”, Semi-therm 21, Semiconductor ThermalMeasurement And Management Symposium, San Jose.Bradley, T.L., Lardner,T.J., Mikic, B.B., June 1971, “Bolted Joint Interface Pressurefor Thermal Contact Resistance”, ASME Journal of Applied Mechanics, pp. 542-545.Chandrashekhara, K. and Muthanna, S.K., 1977, “Stress in Thick Plate with a CircularHole under Axisymmetric Loading,” ASME Int. J. Eng. Science, Vol. 15, pp. 135-146.Chandrashekhara, K. and Muthanna, S.K., 1978, “Pressure Distribution in BoltedConnections, Advances in Reliability and Stress Analysis”, presented at ASME WinterAnnual Meeting, San Francisco, California, pp.117-124, December.Chandrashekhara, K. and Muthanna, S.K., 1979, “Analysis of a Thick Plate with aCircular Hole Resting on a Smooth Rigid Bed and Subjected to Axisymmetric Normal Load,”Act at Mechanica, Vol.33, pp. 33-44.Clausing, A.M., 1966, “Heat Transfer at the Interface of Dissimilar Metals – TheInfluence of Thermal Strain”, International Journal Heat Mass Transfer, Vol.9, pp. 791-801.Curti, G., Raffa, F., Strona., P, Jan-Feb 1985, “Analysis of Contact Area and pressureDistribution in Bolted Plates by Boundary Element Method”, Wire V35, n1.Elliott, D.H., 1965, “Thermal Conductance Across Aluminum Bolted Joints,” ASMEpaper No. 65-HT-53.