document title / titre du document TRP W ORK PLAN ... - emits - ESA

TRP Work Plan 2005-2007
Complete List of Activities
TEC-SB/7935/dc
12/Feb/09
6.- Generic Technologies and Techniques
6.22 - Components
IPC
Appr.
TRP Ref. Title Budget (K€) PP C'try Remarks
SW Clause
applicability
Status as of Contract
2004 2005 2006 2007 2008 31/12/2008
Y2006
T608-34Q
M
Performance benchmarking of European GaN epitaxial wafer suppliers 250 C D FBH, Tesat, UMS - Contracted 20328
Y2006 T608-36QC SRAM based FPGA for space applications 300 C - Intended
Y2006
T608-37QC
Study of long term parametric drifts of EEE components for inclusion in component
detail specifications and worst case analysis
250 C - Intended
Y2006 T608-38QC Survey of available micro and nanotechnology 200 C UK
NPL + Inst. Nanotechnology (UK)
+ Esys (UK)
- Contracted 21669
Y2006 T608-39MC Nanotube re-inforced structural materials for spacecraft applications 250 C - Intended
Y2006 T608-42ET Deep-Sub-Micron ASIC technology assessment and High-Speed-Serial-Links design 1200 C(R) F
C(R) with Atmel (F) and STM (I/F).
See ESA/IPC(2006)88. ST
Microelectronics,
Thales+ISD(GR)+Astrium(UK)
- Contracted
Y2006 T608-43QC GaN Reliability Enhancement and Technology Transfer Initiative (GREAT2) 1,800 C D
See ESA/IPC(2006)89. TESAT
Spacecom + IMEC (B) + Ferdinand
Braun Inst. (D) + FHG (D) + UMS
- Contracted 21499
(D)
Y2001
T-M-QCT-0
2-MT
MTSL Lab 150 150 DN/C IRL NMRC - Contracted 10582
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