document title / titre du document TRP W ORK PLAN ... - emits - ESA

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TRP Work Plan 2005-2007 Description of Activities TEC-SB/7935/dc 12/Feb/09 TRP Reference: Title: T608-39MC Nanotube re-inforced structural materials for spacecraft applications With strength and stiffness properties several 100 times better than that of steel and conductivity better than copper, Carbon Nanotubes (CNT) have extraordinary intrinsic electrical and mechanical properties making them potentially attractive materials for use in lightweight spacecraft structures and subsystems. Research on the possibility of using such materials for improving the properties of known materials such as Carbon Fiber Reinforced Plastics (CFRP), has been performed, and the results indicate that some improvement is indeed possible. The objectives of the proposed activity are to identify and investigate possible improvement of spacecraft structural materials, near term as well as long term. For what concerns near term the work shall focus on the reinforcement of the CFRP resin material. Realistic improvements shall be defined based on literature data and specially manufactured test samples, and shall address improvements related to: - tensile, compressive and shear (ILS) strength; - stiffness; - structural damping; - failure mechanisms; - conductivity;. Relevant manufacturing methodologies shall be investigated and documented. For what concerns long term, (>2015) possible applications of CNT in spacecraft structures shall be evaluated. This shall include the identification of possible new materials, e.g. development of new CNT reinforced fibres and resins, and their possible application areas, including highly loaded spacecraft structures, lightweight flexible deployable and inflatable structures, membranes etc. In addition, the perspective of availability of CNT for European activities shall be considered taking into account the required European non-dependence target, and a related survey document shall be produced. Deliverables: Overview of CNTs and their application as reinforcing element in CFRP structures, test reports, test specimen. Current TRL: TRL1-2 Target TRL: TRL2-3 Application Need/Date: TRL5/6 >2010 Application/Mission: All spacecraft missions Contract Duration: 18 months SW Clause : - Dossier0 Ref.: T-1435 Consistency with Harmonisation Roadmap and Conclusions: Not directly linked to harmonised technology. Page 219 of 227
TRP Work Plan 2005-2007 Description of Activities TEC-SB/7935/dc 12/Feb/09 TRP Reference: Title: T608-42ET Deep-Sub-Micron ASIC technology assessment and High-Speed-Serial-Links design The present activty is in line with the DSM (Deep Submicron Microelectronics) initiative strategy paper (ESA/IPC(2006)88). The activity aims at assessing deep submicron (i.e. 90 nm or below) Application-Specific-Integrated-Circuits (ASIC) technology with higher density chips and lower power consumption for on-board processing applications. Together with the ASICs’ core processing capabilities it is mandatory to improve the efficiency of data transportation (between ASICs, boards and equipments) by mean of embedded High-Speed-Serial-Link (HSSL). The design of ~10Gbps HSSLs with the selected ASIC process is a contextual objective of this activity. The activity shall encompass feasibility study, assessment and trade-offs of the following key issues: - Processes trade offs and selection. - Radiation evaluation (complementary tests): 1. Heavy ions, heavy protons and total dose effects; 2. SEE and SET characterisation; 3. Displacement damage; 4. Radiations effects on high k dielectric. - Reliability: 1. Electro migration; 2. Life time. - Proposal for hardening techniques in order to cope with radiation and reliability issues: 1. Enhancement at process level; 2. Enhancement at layout and cells design level; 3. Identification of the library cells requiring a redesign; 4. Identification of the work involved in order to harden the selected cells or eventually design new ones (clock tree buffers …); 5. Assessment CAD tool flow to support rad-hard library (hardened clock-tree network, TMR, etc.). - High speed serial links: 1. Assessment of the selected process to offer embedded high speed serial links able to provide a 10 Gbps data rate while minimising power consumption (300mW per transceiver) and area; 2. Performance and architecture trade offs; 3. Design of the transceiver IP and implementation of the hardening techniques studied previously; 4. Layout; 5. Simulation post layout. - Preliminary study to define packaging options. - Sustainability of the space business (manufacturing costs, process lifetime, etc.): 1. The manufacturer shall propose a business model for future development activities and identify NRE and RE costs; 2. The manufacturer shall propose a sustainable model related to space business and guaranty access and support to the technology at fair conditions. Deliverables: Radiation and reliability reports, design rule recommendations, preliminary design and simulation report on HSSL, roadmap for the packaging technology, business model definition. Current TRL: TRL2-3 Target TRL: TRL3-4 Application Need/Date: TRL5/6 >2011 TLC: on-board processing, SCI: science & remote sensing instruments, EO: Application/Mission: instruments, TLM&control, high-speed Contract Duration: 18 months rate data downlink. SW Clause : - Dossier0 Ref.: T-7742 Consistency with Harmonisation Roadmap and Conclusions: ESA/IPC(2006)88 Page 220 of 227
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