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<strong>TRP</strong> Work Plan 2005-2007<br />

Complete List of Activities<br />

TEC-SB/7935/dc<br />

12/Feb/09<br />

6.- Generic Technologies and Techniques<br />

6.23 - Materials & Processes<br />

IPC<br />

Appr.<br />

<strong>TRP</strong> Ref. Title Budget (K€) PP C'try Remarks<br />

SW Clause<br />

applicability<br />

Status as of Contract<br />

2004 2005 2006 2007 2008 31/12/2008<br />

Y2003<br />

(03/)EEA-0<br />

02<br />

Metamaterials for Space 250 DN/S CH EPFL - Contracted 18545<br />

Y2006<br />

T608-04Q<br />

M<br />

Assessment of the reliability of High Density Integrated Boards (HDIs) for future<br />

space use<br />

250 C - Intended<br />

Y2006<br />

T608-12Q<br />

M<br />

Study of the impact of the power meshed plane on electromagnetic behaviour of<br />

electronic boards (PCBs).<br />

160 C - Intended<br />

Y2006<br />

T608-15Q<br />

M<br />

Test and validation of contamination models through ground experiments modeling 200 DN/S F Onera - Intended<br />

Y2006<br />

T608-30Q<br />

M<br />

Joining technology to bond Carbon to Carbon in stable sandwich structures 250 DN/S F Alcatel + Snecma - Contracted 20479<br />

Y2006<br />

T608-33Q<br />

M<br />

Radiation stable optical adhesives 300 C D ZARM Technik + FHG (D) - Contracted 20784<br />

Total 6.23 - Materials & Processes 250 250 300 610<br />

Page 97 of 97

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