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document title / titre du document TRP W ORK PLAN ... - emits - ESA

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<strong>TRP</strong> Work Plan 2005-2007<br />

Description of Activities<br />

TEC-SB/7935/dc<br />

12/Feb/09<br />

<strong>TRP</strong> Reference:<br />

Title:<br />

SCI-X11<br />

Large Format Detector Read-Out - Additional work<br />

Within the original contract a basic development for a read-out for future high resolution imaging spectrometers is undertaken.<br />

The study will focus on the electronics required to readout future high resolution imaging spectrometers. It will result in a<br />

complete instrument capable of delivering packaged data containing spectral and imaging outputs from detector arrays of up<br />

to 10,000 pixels. The key issues to be addressed are the design of the full readout chain, power requirements, noise<br />

performance, thermal requirements, and the rate and speed limitations.<br />

More in detail, a read-out electronics for large array detectors shall be designed, fabricated and tested. The design shall be<br />

scalable, radiation tolerant and highly integrated. In order to re<strong>du</strong>ce the required interface circuitry to an absolute minimum,<br />

the ASIC shall include:<br />

1) ultra-low noise preamplifiers for each indivi<strong>du</strong>al detector pixel, to achieve detector statistical noise limits<br />

2) programmable filter stages for each pixel<br />

3) event detection circuitry, with internally programmable threshold settings<br />

4) analog-to-digital converters<br />

5) event prioritization circuitry<br />

6) digital glue logic.<br />

In addition to the basic development summarised above, it is now proposed to place a CCN to cover additional testing and<br />

validation issues. During the development of the ASIC, it was realized that the circuit could not be sufficiently tested without<br />

any detector connected to it. Therefore, in order to validate the full functionality, it is required to bump-bond a 2-D detector<br />

array to the ASIC and test this assembly under X-ray radiation. In addition, and for the specific need for BepiColombo, the<br />

ASIC needs to be validated under gamma and proton irradiation. These radiation tests will also help to understand the basic<br />

limitations of the particular foundry and CMOS process, which is used not only for this development but also by several other<br />

institutes / companies intending to design ASIC for BepiColombo and Solar Orbiter.<br />

Deliverables:<br />

Set of ASIC wafers and ASIC + Detector assemblies as well as the full design databases.<br />

Current TRL: TRL2-3 Target TRL: TRL4 Application Need/Date: TRL5 by 2009<br />

Application/Mission: XEUS / Bepi Colombo Contract Duration: 12 months<br />

SW Clause : - Dossier0 Ref.: T-757<br />

Consistency with Harmonisation<br />

Roadmap and Conclusions:<br />

N/A<br />

<strong>TRP</strong> Reference:<br />

Title:<br />

SCI-X4<br />

Optical rejection filter<br />

Deliverables:<br />

Current TRL: Target TRL: Application Need/Date:<br />

Application/Mission:<br />

Contract Duration:<br />

SW Clause : - Dossier0 Ref.: T-712<br />

Consistency with Harmonisation<br />

Roadmap and Conclusions:<br />

Page 49 of 227

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