Examination of Firearms Review: 2007 to 2010 - Interpol

Concentrations (TTLC). Phones were grouped by physical dimensions; phones outside
a specific size range were eliminated. Phones were shredded, homogenized, then
divided equally by mass. The authors determined that the phones exceeded TCLP
limits for lead and failed the standards of the TTLC for five metals (copper, nickel, lead,
antimny, and zinc). No limits were exceeded in the WET test. 22
Keith et al. used four different leachability tests on a selection of computer CRTs,
printed circuit boards, computer mice, television (TV) remote controls, and mobile
phones. Each of the six devices were crushed and then tested using the US EPA
TCLP, the US EPA Synthetic Precipitation Leaching Procedure (SPLP, Method 1312),
the Dutch Environmental Agency Availability Test (EA NEN 7371), and method DIN S4
of the Institut fur Normung, Germany. The extracts were analyzed for lead, cadmium,
chromium, and silver. TCLP extractions were repeated on composite CRT glass (one
additional extraction) and filter papers with residual solids (two additional extractions),
and then those extracts were filtered and analyzed. Results indicated increased lead
leachability with smaller CRT and circuit board particle sizes and extracted lead
increased with the repeated TCLP extractions. The SPLP, NEN 7371, and DIN S4 tests
yielded very low results for the leachable metals, and the authors did not recommend
those tests for assessing potential metal leachability from e-waste. 21
Researchers are actively seeking ways to detect unwanted chemicals in EEE
fabrication, ways to better deconstruct EEE for recovery or reuse of materials, and ways
to destroy or isolate the usable and disposable WEEE. This requires a thorough
understanding of the chemical composition of the devices, and most researchers have
provided the chemical analysis process details and data in their published work. Lee
and Wright developed a standard operating procedure for assessing and confirming
compliance with regulations on the use of ozone-depleting chemicals. 23 Cui and
Forssberg used a variety of methods to characterize television scrap and determine
cost-effective ways to separate the components of a shredded TV mix for potential
material recovery. 182 Lee et al. presented a good overview of the recycling process for
scrap computers, including tables on compositions of components, separation methods,
and CRT coating-removal methods. 183 Méar et al. characterized the waste funnel and
panel glass from dismantled CRTs in order to develop reuse applications. 184 Chen et al.
tested a pyrovacuum process that removes and recovers lead from the funnel glass of
CRTs and makes a porous glass residue. 185 Guo et al. reviewed the recycling methods
for the non-metallic fractions of printed circuit boards. 186 Hino et al. developed a
method for pulverizing waste printed circuit boards with integrated circuits. 187 Niu and Li
studied two methods for making printed wire boards non-hazardous: high-pressure
compaction and cement solidification. The low-impact resistance of the compacted
samples made them too unstable to be a long-term disposal solution. The results from
the TCLP tests on the highly impact-resistant, solidified samples showed lead at
concentrations well below the regulatory limits; a good indication that this method could
render the boards non-hazardous. 188
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