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Scientific and Technical Aerospace Reports Volume 38 July 28, 2000

Scientific and Technical Aerospace Reports Volume 38 July 28, 2000

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agreed that the NO(sub x) levels could be brought down well below California ULEV levels without increasing either the nonmethane<br />

organic gases or the CO levels.<br />

NTIS<br />

Compressed Gas; Exhaust Emission; Liquefied Natural Gas<br />

<strong>2000</strong>0063496 Jet Propulsion Lab., California Inst. of Tech., Pasadena, CA USA<br />

Advanced Interconnect Roadmap for Space Applications<br />

Galbraith, Lissa, Jet Propulsion Lab., California Inst. of Tech., USA; May 1999; 13p; In English; No Copyright; Avail: CASI;<br />

A03, Hardcopy; A01, Microfiche<br />

This paper presents the NASA electronic parts <strong>and</strong> packaging program for space applications. The topics include: 1) Forecasts;<br />

2) Technology Challenges; 3) Research Directions; 4) Research Directions for Chip on Board (COB); 5) Research Directions<br />

for HDPs: Multichip Modules (MCMs); 6) Research Directions for Microelectromechanical systems (MEMS); 7) Research<br />

Directions for Photonics; <strong>and</strong> 8) Research Directions for Materials. This paper is presented in viewgraph form.<br />

CASI<br />

Electronic Packaging; Technology Utilization; Joining<br />

<strong>2000</strong>0064016 Institute TNO of Applied Physics, Delft, Netherl<strong>and</strong>s<br />

Integration of BATSOFT <strong>and</strong> FEM Calculations<br />

Vermeulen, R. C. N., Institute TNO of Applied Physics, Netherl<strong>and</strong>s; deJong, C. A. F., Institute TNO of Applied Physics, Netherl<strong>and</strong>s;<br />

Dec. 23, 1999; 46p; In English; Original contains color illustrations<br />

Contract(s)/Grant(s): A98/KM/131; TNO Proj. 008.00654/01.01<br />

Report No.(s): TD-99-0060; TPD-RPT-990218; Copyright; Avail: Issuing Activity<br />

In order to be able to predict the mobility of foundations (seating plus infinite bottom) in a simple way TNO-TPD developed<br />

the BATSOFT program. This program is very efficient because analytical approximations of the foundations are used such as<br />

beams <strong>and</strong> plates. However, sometimes the seating can not be approximated by simple beams <strong>and</strong> plates. A possible solution is<br />

then to calculate the seating mobilities by a Finite Element (FE) program. The BATSOFT program is adapted in such a way that<br />

FE results can be used. The input mobilities of three foundations are calculated using this ’hybrid’ BATSOFT. An excellent agreement<br />

has been found between calculations <strong>and</strong> measurements for a solid slender beam on an infinite plane. For the MF column<br />

hybrid BATSOFT yields better results than traditional BATSOFT. For the Sea Cooling Water Pump Foundation a good similarity<br />

is found for the mobilities of the clamped FE model <strong>and</strong> the measurements. When hybrid BATSOFT is used the similarity gets<br />

worse. The reason for that is not clear <strong>and</strong> it is recommended to examine this. Moreover it is recommended to extend BATSOFT<br />

from 2D to 3D <strong>and</strong> to implement multi point effects for the coupling of seating <strong>and</strong> infinite bottom.<br />

Author<br />

Computer Programs; Computation; Mobility; Sea Water; Beams (Supports)<br />

<strong>2000</strong>0064071 Jet Propulsion Lab., California Inst. of Tech., Pasadena, CA USA<br />

Chip Scale Package Implementation Challenges<br />

Ghaffarian, Reza, Jet Propulsion Lab., California Inst. of Tech., USA; [1998]; 9p; In English; No Copyright; Avail: CASI; A02,<br />

Hardcopy; A01, Microfiche<br />

The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies <strong>and</strong> private companies have<br />

jointed together to pool in-kind resources for developing the quality <strong>and</strong> reliability of chip scale packages (CSPs) for a variety<br />

of projects. In the process of building the Consortium CSP test vehicles, many challenges were identified regarding various aspects<br />

of technology implementation. This paper will present our experience in the areas of technology implementation challenges,<br />

including design <strong>and</strong> building both st<strong>and</strong>ard <strong>and</strong> microvia boards, <strong>and</strong> assembly of two types of test vehicles. We also discuss the<br />

most current package isothermal aging to 2,000 hours at 100 C <strong>and</strong> 125 C <strong>and</strong> thermal cycling test results to 1,700 cycles in the<br />

range of -30 to 100 C.<br />

Author<br />

Packages; Quality; Reliability<br />

<strong>2000</strong>0064090 Jet Propulsion Lab., California Inst. of Tech., Pasadena, CA USA<br />

Chip Scale Package Integrity Assessment by Isothermal Aging<br />

Ghaffarian, Reza, Jet Propulsion Lab., California Inst. of Tech., USA; [1998]; 6p; In English; No Copyright; Avail: CASI; A02,<br />

Hardcopy; A01, Microfiche<br />

61

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