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Scientific and Technical Aerospace Reports Volume 38 July 28, 2000

Scientific and Technical Aerospace Reports Volume 38 July 28, 2000

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<strong>2000</strong>0067664 Jet Propulsion Lab., California Inst. of Tech., Pasadena, CA USA<br />

Different Approaches for Ensuring Performance/Reliability of Plastic Encapsulated Microcircuits (PEMs) in Space<br />

Applications<br />

Gerke, R. David, Jet Propulsion Lab., California Inst. of Tech., USA; S<strong>and</strong>or, Mike, Jet Propulsion Lab., California Inst. of Tech.,<br />

USA; Agarwal, Shri, Jet Propulsion Lab., California Inst. of Tech., USA; Moor, Andrew F., Johns Hopkins Univ., USA; Cooper,<br />

Kim A., Johns Hopkins Univ., USA; [<strong>2000</strong>]; 8p; In English; No Copyright; Avail: CASI; A02, Hardcopy; A01, Microfiche<br />

Engineers within the commercial <strong>and</strong> aerospace industries are using trade-off <strong>and</strong> risk analysis to aid in reducing spacecraft<br />

system cost while increasing performance <strong>and</strong> maintaining high reliability. In many cases, Commercial Off-The-Shelf (COTS)<br />

components, which include Plastic Encapsulated Microcircuits (PEMs), are c<strong>and</strong>idate packaging technologies for spacecrafts due<br />

to their lower cost, lower weight <strong>and</strong> enhanced functionality. Establishing <strong>and</strong> implementing a parts program that effectively <strong>and</strong><br />

reliably makes use of these potentially less reliable, but state-of-the-art devices, has become a significant portion of the job for<br />

the parts engineer. Assembling a reliable high performance electronic system, which includes COTS components, requires that<br />

the end user assume a risk. to minimize the risk involved, companies have developed methodologies by which they use accelerated<br />

stress testing to assess the product <strong>and</strong> reduce the risk involved to the total system. Currently, there are no industry st<strong>and</strong>ard procedures<br />

for accomplishing this risk mitigation. This paper will present the approaches for reducing the risk of using PEMs devices<br />

in space flight systems as developed by two independent Laboratories. The JPL procedure involves primarily a tailored screening<br />

with accelerated stress philosophy while the APL procedure is primarily, a lot qualification procedure. Both Laboratories successfully<br />

have reduced the risk of using the particular devices for their respective systems <strong>and</strong> mission requirements.<br />

Author<br />

<strong>Aerospace</strong> Industry; Encapsulated Microcircuits; Reliability; Technology Utilization; Plastics; NASA Space Programs<br />

<strong>2000</strong>0067674 Jet Propulsion Lab., California Inst. of Tech., Pasadena, CA USA<br />

Effects of Hydrogen on Tantalum Nitride Resistors<br />

Weiler, James, Jet Propulsion Lab., California Inst. of Tech., USA; [<strong>2000</strong>]; 1p; In English; No Copyright; Avail: Issuing Activity;<br />

Abstract Only<br />

In this paper we report on observations of degradation of thin film Tantalum Nitride chip resistors in a hermetically sealed<br />

hybrid. The observations have been attributed to the reaction of residual Palladium with desorbed Hydrogen on the surface of the<br />

resistor film. Hydrogen gas has been observed to desorb from various sources within the sealed hybrid as a result of temperature<br />

elevation. The hydrogen gas has been reported to undergo a reaction with elements such as Platinum <strong>and</strong> Palladium causing device<br />

degradation in Gallium Arsenide Field Effect Transistors. The experimental procedures <strong>and</strong> data relating to this observation along<br />

with a discussion of available risk mitigation techniques will be presented.<br />

Author<br />

Hydrogen; Tantalum Nitrides; Resistors; Degradation; Thin Films<br />

34<br />

FLUID MECHANICS AND THERMODYNAMICS<br />

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<strong>2000</strong>0062307 Jet Propulsion Lab., California Inst. of Tech., Pasadena, CA USA<br />

A Priori Subgrid Scale Modeling for a Droplet Laden Temporal Mixing Layer<br />

Okongo, Nora, Jet Propulsion Lab., California Inst. of Tech., USA; Bellan, Josette, Jet Propulsion Lab., California Inst. of Tech.,<br />

USA; [<strong>2000</strong>]; 8p; In English; No Copyright; Avail: CASI; A02, Hardcopy; A01, Microfiche<br />

Subgrid analysis of a transitional temporal mixing layer with evaporating droplets has been performed using a direct numerical<br />

simulation (DNS) database. The DNS is for a Reynolds number (based on initial vorticity thickness) of 600, with droplet mass<br />

loading of 0.2. The gas phase is computed using a Eulerian formulation, with Lagrangian droplet tracking. Since Large Eddy Simulation<br />

(LES) of this flow requires the computation of unfiltered gas-phase variables at droplet locations from filtered gas-phase<br />

variables at the grid points, it is proposed to model these by assuming the gas-phase variables to be given by the filtered variables<br />

plus a correction based on the filtered st<strong>and</strong>ard deviation, which can be computed from the sub-grid scale (SGS) st<strong>and</strong>ard deviation.<br />

This model predicts unfiltered variables at droplet locations better than simply interpolating the filtered variables. Three<br />

77

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